Technical Library | 2017-10-05 17:13:04.0
Intermetallic compounds (IMC) in solder bonds are commonly considered critical for the reliability of interconnections. The microstructure and thermal aging characteristics of solder bonds of crystalline silicon solar cells are investigated, whereby two solders, Sn60Pb40 and a lead-free, low melting point alternative Sn41Bi57Ag2 are considered.
LED PCB X-Ray Inspection System X-1200 SMT /Semicon/Solar/Harness Connector/LED PCB (Special for LED 1200mm) High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire 90KV 5μm closed X-ray tube,with long life,maintenance in free 1.
X-Ray inspection system X6600 SMT/Semicon/Solar/Connector/LED High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire 90KV 5μm closed X-ray tube,with long life,maintenance in free 1.3 million high resolution digital flat panel det
X-Ray inspection system X7600 SMT/Semicon/Solar/Connector/LED High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire 90KV 3μm (130 KV Optional)closed X-ray tube,long life time,maintenance in free 2.3 mllion high resolution digita
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon
Industry Directory | Consultant / Service Provider / Manufacturer
SemiPack Services is an Electronic Manufacturing Support Service to the semiconductor industry. We specialize in providing support services to high-mix low-volume (HMLV) customers
High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon
Industry Directory | Manufacturer
Sikama International designs, develops, manufactures and markets reflow solder furnaces/curing systems, featuring our patented conduction+convection heating and cooling technology. Our furnaces are designed for efficient use of power and gas.
The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The
