Electronics Forum | Thu Jun 25 16:07:44 EDT 1998 | G. Hamblett
Looking for articles/data comparing the quality/reliability of mass reflowed SMT solderjoints versus hand soldered SMT solderjoints.
Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT
I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT
Electronics Forum | Wed Apr 09 14:09:54 EDT 2003 | davef
MA/NY DDave, I'll take your money. I'm betting on the Class II, whatever that is, because: * Solder is the same. * Board is the same from a fabrication and probably materials standpoint. * Components are the same. * Processing is the same. ... but
Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon
| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Mon Nov 12 06:05:15 EST 2001 | nop_e
Dear all I 'm looking the minimum X-Ray machine capability that is capable to inspect the solder joint of BGAs, Fine pitch BGA and CSP such as open, poor solder joint ,etc... What is the machine specification needed? Thank you for your advise.
Electronics Forum | Mon Jan 15 18:24:40 EST 2007 | greg york
probably volatiles in the joint outgassing as it comes over the wave, is the joint a yellowy colour as well, or any pictures we can view cheers greg
Electronics Forum | Thu Feb 19 12:56:29 EST 1998 | Earl Moon
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly. Voids in excess of 20% by each solder ball volume is cause for rejection. Causes are improperly managed proc
Electronics Forum | Fri Jan 12 15:50:51 EST 2007 | pyro747
Hello all, We have resently run across a solder joint from a through hole part that looks to have a wrinkle effect (star look) from the wave? No pattern it just happens here and there, and some of the joints on the same row look smooth and good. Any
Electronics Forum | Wed Jan 07 17:34:52 EST 2015 | duchoang
Customer puts our board to thermal test. Test cycle is -55c to 85c, repeat cycle in 15-20min. After 600 cycles, lot of TSOP joints are cracked, leads lifted. There are reasons such as thin PCB, mechanical impacts, warped PCB... My question is, how lo
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