Electronics Forum | Fri Jul 19 13:09:55 EDT 2019 | edhare
Hi, Are you referring to the condition illustrated here? ... https://www.semlab.com/qfn-solder-fillets In this case, the solder was wicked down an attached un-filled PTH via. Ed Hare SEM Lab, Inc.
Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
Electronics Forum | Thu Jun 29 06:26:36 EDT 2006 | AR
Hi Slaine, The terminations are still present on the component but all the solder (including the pad finish) has coalesced on to the terminations. The termination that normally is shiny and bright in colour has turned matte grey on that zone where t
Electronics Forum | Sun Feb 10 20:27:50 EST 2008 | jmelson
As long as it doesn't have a thermal pad soldered under the package, it shouldn't be a big problem. Small, pointed iron, stereo zoom microscope if you can find one, or a head-mounted magnifier. Lots of light. Rest the heel of your hand on the boar
Electronics Forum | Tue Jun 09 09:28:57 EDT 1998 | Earl Moon
| | If any one needs a procedure for rework and repair of BGA there is a document on my Web Site to download www.bobwillis.co.uk | | | What methods do people use to dress pads after removing and before replacing the BGA? | | | We use solder wick and
Electronics Forum | Thu Jun 04 16:14:04 EDT 1998 | Terry Burnette
| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F We've bee
Electronics Forum | Thu Jul 31 23:52:12 EDT 2008 | roc2x
Hi, Im having problem on tombstone, The part is LF chip component 1005, and my solder paste is WS leded. tombstone is not in a deg angle but one side is soldered but the other side is just sitting on the solder. Looks like my solder can not wick up t
Electronics Forum | Thu Jul 31 23:57:11 EDT 2008 | roc2x
Hi, Im having problem on tombstone, The part is LF chip component 1005, and my solder paste is WS leded. tombstone is not in a deg angle but one side is soldered but the other side is just sitting on the solder. Looks like my solder can not wick up t
Electronics Forum | Wed Jul 15 18:04:43 EDT 2015 | mikekeens
If it is important to have vias within thermal pads to help dissipate heat i would recommend using solder mask to stop the solder from wicking down the holes and resulting in insufficient solder. Some further info can be found here:- http://www.surf
Electronics Forum | Thu Feb 24 11:05:53 EST 2000 | Russ
I usuallly like to have the pad size the same size as the ball up to +2mil, the pcb solder mask opening to be +4 mil from the pad size (I have found this to aid in Xray inspection for opens since you can see the little tail of the solder wicking up t
