Electronics Forum | Fri May 07 12:02:28 EDT 2004 | Dreamsniper
From my understanding paste on BGA pads are applied only to help in holding the component as the PCB is conveyed during the manufacturing process then soldered. But during rework on BGA's do I have to apply Solder Paste or just Flux? What's the diffe
Electronics Forum | Mon Jun 14 12:22:24 EDT 2010 | chrisatae
What can I do to reduce BGA solder voids?
Electronics Forum | Sun Dec 06 21:31:47 EST 2009 | rajeshwara
Attached is the BGA BALL soldered underneath reflow profile , plz check and advice.
Electronics Forum | Fri Oct 07 09:19:54 EDT 2005 | Kris
the direction in which the solders cool in a BGA are also different than the rest of the boards as the joints " hidden" to ambient. Refer to an analogus phenomenon in the cookson application note. http://www.cooksonsemi.com/pdfs/How%20&%20Why%20Bum
Electronics Forum | Tue Jun 19 19:03:31 EDT 2007 | diesel_1t
Hi folks. If the solder is on the BGA but is not soldered at all on the pads, then you can discard BGA solder issues, by the other hand; you might be experiencing wicking due to heat is being absorbed on component so the balls on BGA are hotter than
Electronics Forum | Mon Jul 17 01:45:32 EDT 2023 | hazira1991
Hello, Im currently having BGA solder short issue which happen only at the center of the BGA during fresh production run. During rework using SRT also i did encounter the same solder short issue. Kindly provide your thoughts on this as how to appr
Electronics Forum | Wed Sep 08 16:21:01 EDT 1999 | Chris McDonald
Has anybody have any experience with Top placement of BGA's. GLue descretes on bottom and then wavesolder.?
Electronics Forum | Fri Aug 25 09:25:41 EDT 2006 | YQ Deng
For FR4 ENIG PCB: 1. In a normal condition, what is the broken location after BGA peeled off?(FR4 layer or Ni layer or solder ball) 2. What is the soldering acceptance criteria for BGA in CMK?
Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Thu Sep 02 14:51:28 EDT 2004 | Jovy
Hi All, I Need to know What is the main Concepts and Basics to Use IR in Soldering BGA & mBGA Ics, for Example - what are Range of Heating Temperatures - What is the Preheating means !? - What is the best Heat/Time Curve Ive to care about while using
