Electronics Forum | Thu Jun 24 13:12:15 EDT 1999 | MD Cox
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Thu Jun 24 15:58:46 EDT 1999 | Adam Pratt
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Sat Feb 12 10:33:31 EST 2000 | Francois Racine
First I'm a french people so excuse my bad english writing. I have a complete smt production line. First a screen printer DEK 240, a chip shooter PANASERT MVIIV, a multifonction machine MULTITRONIKS EP6000, a reflow oven at the end of the SMT line a
Electronics Forum | Fri Sep 07 08:57:28 EDT 2001 | Hussman
Por, You talking wave solder or reflow solder? At wave, nitrogen is the way to go. Just like you stated, it does affect the surface tension. If you're reflowing, I wouldn't go nitrogen unless you have to. Improper stencil design is usually the c
Electronics Forum | Thu Jun 24 18:24:13 EDT 1999 | Christian N.
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Tue Oct 24 19:50:34 EDT 2000 | Dave F
In response to your questions: * Will a polyurethane squeegee blade help? NO * Will a Pro-Flow head help? NO, but it might be a cool excuse to buy one. Unfortunately, you will look like a jerk, if you talk your boss into buying one and then he /
Electronics Forum | Thu Mar 30 09:32:54 EST 2006 | russ
Not arguing dan, but are you positive that they are not copper? anyway, what is happening is as the parts sucks down onto the board from reflow the extra paste is notnecessarily sqeezed out but it has no place to go. So it will form this ball on th
Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff
| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes
Electronics Forum | Mon Nov 17 11:09:56 EST 2003 | Frank
Hi, I have a soldering problem with a header SMT straight single row of 8 pins. It's a samtec #TSM-108-03-T-SV-P (P&P). The first problem I have is an allignement one. I do not use alignement pin for now but I expect to use it. Concerning solder
Electronics Forum | Tue Aug 10 15:56:30 EDT 1999 | Jason Gregory
Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation i
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