Electronics Forum | Fri Dec 27 14:11:18 EST 2002 | cnotebaert
We have placed these parts. I have not had problems with them but when I designed the stencil we reduced the app for the large thermal by 20% to reduce the chance of problems like your having. If the balls are close (.040-.050" or
Electronics Forum | Sat Nov 22 08:14:47 EST 2003 | davef
When the pads on the board are too large, the component tends to swim. This skewing can be a BIG problem with connectors, eh?
Electronics Forum | Fri Dec 27 01:30:13 EST 2002 | haran
Currently we are running a BGA with a big thermal pad in the middle of the package and encountered high defect of solder shorts.I would like to check whether anyone has experience this problem and how this can be rectified?.
Electronics Forum | Tue Dec 02 08:51:31 EST 2003 | Daniel Werkhoven
Dear Frank, could it be that your component legs are coated with a leadfree finish? This can have an inpact on soldering when your temp.peak in only 220�C and the melting point of pure Tin is 237�C. Best regards, Daniel
Electronics Forum | Thu Dec 19 20:39:49 EST 2013 | jimmy_wcy
Urgent!! I have a big problem... I just notice that 5000 pcs PCB had solder bead scatter around pls advise a solution to clean up the beading. thanks in advance.
Electronics Forum | Wed Jan 12 13:57:28 EST 2005 | russ
Are you positive that the solder is sticking to the bottom of the fixture OR is it pushing the wave down so far that the solder is "squirting" out from underneath the pallet. This happens when deep/thick pallets are run at the same wave height as a n
Electronics Forum | Sat Jun 23 12:42:20 EDT 2001 | genny
OK, to reopen this and muddy the water a little more, What is the difference between REL0 and ROL0 solder. The solder paste that more than one of our suppliers is using is AIM293+ - this is REL0 The no-clean solder wire we use in house is ROL0, mad
Electronics Forum | Thu Nov 19 10:12:38 EST 1998 | Brian Conner
| For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave solder a
Electronics Forum | Wed Aug 22 17:00:51 EDT 2001 | Doug Chambers
I am researching articles with respect to intermetalics growth associated with gold as a final metalization. We are currently looking at a few options that include a 10uin flash followed by a 30uin selective and a total 30uin finish. The concern is
Electronics Forum | Mon Oct 22 17:47:47 EDT 2001 | davef
We on SMTnet have danced around this component package, but there is not a "background" of knowledge in the fine SMTnet Archives. We in our company use this component package, but have not seen the problems you discuss. [We see other problems.] Th
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