New Equipment | Solder Materials
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages
New Equipment | Solder Materials
Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien
Technical Library | 2021-09-08 14:03:55.0
There is need in the industry to understand the effects of silver presence in solders from various applications perspective. This article will attempt to present a review of the key published results on the silver containing alloys along with results of our internal studies on wave soldering, surface mount and BGA/CSP applications. Advantages and disadvantages of silver at different levels will be discussed. Specifically this report will focus on the effect of silver on process conditions, drop shock resistance, solder joint survivability in high strain rate situations, thermal fatigue resistance, Cu dissolution and effects of silver in combination with other alloy additives. Specific application problems demanding high silver level and other requiring silver level to the minimum will be discussed.
New Equipment | Surface Finish
Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed
Technical Library | 2014-10-02 20:10:07.0
Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As the results, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently.In this paper, we'll present the performance and process capability of various low/no silver alloy solder pastes. Data from printability, wetting test, slump test, solder ball test, voiding, etc… will be discussed and compared with the control SAC305 solder paste. Benefits and concerns of using low/no silver alloy solder paste materials will also be addressed.
New Equipment | Solder Materials
KappAloy15™ - 85%Sn - 15%Zn – has a wider plastic range of 390°F - 500°F (199°C - 260°C). This makes it ideal for hand soldering Aluminum plates and parts, allowing manipulation of the parts as the solder cools. KappAloy™ Tin-Zinc solder is designe
New Equipment | Solder Materials
95% Tin / 5% Antimony a.k.a. "Antimonial Tin" is a Lead solder replacement for soldering electrical equipment, Copper tubing, and cooling coils for refrigerators. Joints are of moderate strength where the higher strength and higher cost of KappZapp™
Industry Directory | Manufacturer
manufactures solder preforms , hermetic covers , heat spreaders and custom welded assembllies
New Equipment | Solder Materials
NC275B Liquid Flux is a water-based VOC-Free flux that has performance and reliability characteristics equal or superior to many alcohol-based fluxes. A medium-solids/residue flux, NC275B can be used with all common lead-free wave soldering alloys in
Industry Directory | Manufacturer
With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.
