Industry Directory | Consultant / Service Provider / Manufacturer / Other
Welcome to the website of Conex Screws and Fasteners: India's largest manufacturers of Brass Screws and Brass fasteners. We are one of the key players in the field of all kinds of Brass, Copper and Stainless Steel Screws.
Parts & Supplies | SMT Equipment
, CM402/CM602 cutter solenoid valve N510029538AA / KXF0DR6AA00: VQZ1321Y-5MO-C6 (old) / VQZ1321Y-5MO1-C6 (new) 2, CM402/CM602 cutter solenoid valve N510028350AA: VV5QZ12-03-X132 3, CM402/CM602 valve head KXF0DX8NA00 :10-VQ110U-5MO-X46 4, CM40
ScanINSPECT VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in process setup and new product introduction in the PCB or Hybrid Microcircuit assembly industries. ScanINSPECT VPI
Terminals Harwin Terminals are useful for a variety of connection styles and location requirements. Choice of turned and blade designs. Solder and wire-wrap location points. Test points. Single male contact for use with applicable
New Equipment | Cleaning Equipment
The patented and award winning FLOOD BOX provides the absolute best cleaning results while also reducing chemisty usage and water loss. This is the perfect machine for low stand off components, highly dense boards, or to remove particularly stubborn
New Equipment | Cleaning Equipment
STENCIL / MISPRINT / PCB DE-FLUXING All IN 1 SYSTEM The X-Series system is designed around counter-rotating spray bars featuring fan jet sprays. The added pressure allows the system to successfully clean small pitch stencils, low stand-off compone
New Equipment | Cleaning Equipment
Austin American Technology's MicroJet EC® breakthrough advances in cleaning technology bring Progressive Energy Dynamics to the MicroJet EC® In-line Cleaning System resulting in cleaning power unequaled in its class. Developed using complex modeling
Industry News | 2015-04-09 19:50:17.0
Aqueous Technologies announces that its CEO Michael Konrad presented during the recent SMTA Intermountain Expo at Boise State University. Mr. Konrad presented “Low Standoffs, High Densities, and High Reflow Technologies. The Challenges of Modern Day Cleaning.
Technical Library | 2007-03-28 10:18:33.0
Legislation against the use of lead in electronics has been the driving force behind the use of lead-free solders, surface finishes, and component lead finishes. The major concern in using lead-free solders in the assembly and rework Chip Scale Packages (CSPs) is the relatively high temperatures that the components and the boards experience. Fine-pitch CSPs have very low standoff heights following assembly making inspection and rework of these components more difficult. One other concern pertinent to rework is the temperature of the neighboring components during rework. These issues, coupled with the limitations of rework equipment to handle lead-free reflow temperatures, make the task of reworking lead-free assemblies more challenging.
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
