Electronics Forum | Wed Oct 11 15:40:34 EDT 2006 | Steve Gregory
Don't think there's any easy way to clean under a LCC, but you might want to consider this: http://www.winslowautomation.com/ccmd.asp A dead simple way to mount solder columns onto LCC's and then solder the part to the PCB with a stand-off of abou
Electronics Forum | Wed Aug 13 09:20:05 EDT 2008 | wrongway
we tested this kind of part about 3 years ago did a few prototypes I did'nt know how it was going to work but our old amistar picked it and placed it just fine used a small nozzle with a o-ring on the end of it I think it did ok going across the wav
Electronics Forum | Thu Aug 21 08:33:09 EDT 2008 | davef
There is no standard as such. It's easy to see why. It's too complicated and has such a small payoff. Standoff is comprised of: * Package height * Solder thickness between the pad and the component lead * Delta of pad thickness and solder mask For p
Electronics Forum | Thu Sep 30 11:30:46 EDT 2010 | babe7362000
Take a few parts from the reel and look close at > the parts to make sure the bottom surface of the > leads is below the bottom surface of the body. Yes I did that and they are below the body. I found the problem I think. The solder mask is abo
Electronics Forum | Fri Sep 02 16:22:37 EDT 2011 | ttaubert
Are there SMT mechanical components like that could be used for orientating PCB-level optics on the board and do not require holes in the board? Their final position would solely depend on the reflow. A height of 1/8" would be sufficient. I was con
Electronics Forum | Thu Sep 22 10:28:48 EDT 2011 | davef
We agree with you. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This could reduce the reliability of your product, somewhat. Flux or gel may be use
Electronics Forum | Mon Nov 14 01:46:12 EST 2011 | julien
We already have contact with Zestron and we try several chemicals and process (Immersion, aspersion, vapor degreasing). And we always find something under low standoff component. Concerning the flow pressure and shadowing, we try different position
Electronics Forum | Fri Apr 20 01:42:37 EDT 2012 | thmeier
If you extend the pads you get the effect that the solder below the component is pushed to the outside land which results in a very low standoff of the component, deteriorate the overall quality of the solder joint. Hot air (pencil or some of the sem
Electronics Forum | Sat Feb 02 07:07:47 EST 2013 | bandjwet
The keys to avoiding the voids we have found are: 1. Proper reflow profile 2. Proper stencil design 3. Prebumping using either a metal stencil or StencilMate stencils (and then using paste flux to attach later) http://www.solder.net/products/stencilm
Electronics Forum | Tue Oct 06 13:46:35 EDT 2015 | deanm
Agree. However the LGA has an even lower standoff, so I would think it would be an even greater challenge. The LGA is a cheaper choice but want to know from those who have done both if the extra cost of the SnPb BGA would pay for itself in lower rew
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