Full Site - : stencil design fine pitch components (Page 10 of 105)

PFC Flexible Circuits Limited

Industry Directory | Consultant / Service Provider / Manufacturer

PFC Flexible Circuits Limited designs, manufactures, and assembles flexible circuits; single-sided, double-sided, multilayer and rigid flex. We are ISO 9001 and 13485 approved.

Study on Solder Joint Reliability of Fine Pitch CSP

Technical Library | 2015-12-31 15:19:28.0

Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.

Flex (Flextronics International)

2003 - Semi-automatic Stencil & Pallet Cleaner

2003 - Semi-automatic Stencil & Pallet Cleaner

New Equipment | Cleaning Equipment

A Complete Stencil Cleaning Process - From One Source! Clean solder paste, adhesives and flux residue in one machine Two ultrasonic wash tanks eliminate cross contamination issues Safely clean solder paste at ambient temperature and othe

Smart Sonic Stencil Cleaning Systems

SPR-45VA Cost-effective Automated SMT Stencil Printer

SPR-45VA Cost-effective Automated SMT Stencil Printer

New Equipment | Printing

Cost effective automated stencil printer with SMTrue(TM) Vision Assist for precise alignment of stencil to PCB boards down to 12 mil ultra fine pitch components. Obtain high quality stencil printing of printed circuit boards with the SPR-45VA with S

DDM Novastar Inc

Position Accuracy Machines for Selective Soldering Fine Pitch Components

Technical Library | 2015-02-27 17:06:01.0

The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process window for designers. THT connectors can be soldered on the top and bottom side of boards, board in board, PCBs to metal shields or housing out of plastic or aluminum are today's state of the art. The materials that are used to make the solder connections require higher temperatures. Due to the introduction of lead-free alloys, the boards need more heat to get the barrels filled with solder. This not only affects the properties of the flux and components, but the operation temperatures of solder machines become higher (...)First the impact of temperature will be discussed for the separate process steps and for machine tooling. In the experimental part measurements are done to verify the accuracy that can be achieved using today's selective soldering machines. Dedicated tooling is designed to achieve special requirements with respect to component position accuracy.

Vitronics Soltec

Electroformed SMT Stencils

Electroformed SMT Stencils

New Equipment | Solder Paste Stencils

Stentech is at the forefront of the next generation of stencils, Electroformed Stencils, with more than ten years of research and development. Stentech has now been manufacturing quality Electroformed Stencils for over five years for our North Americ

Stentech

Stencil Options for Printing Solder Paste for .3 Mm CSP's and 01005 Chip Components

Technical Library | 2023-07-25 16:42:54.0

Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.

Photo Stencil LLC

ErgoSonic - Automatic / Closed loop Stencil & Pallet Cleaner

ErgoSonic - Automatic / Closed loop Stencil & Pallet Cleaner

New Equipment | Cleaning Equipment

The first ergonomicly designed front-loading ultrasonic stencil cleaner The ErgoSonic Model Stencil & Pallet Cleaner is fully automatic and programmable. The operator loads the stencil into an empty chamber and selects the desired cleaning profile.

Smart Sonic Stencil Cleaning Systems

SMT Stencil Printers for PCB Assembly

SMT Stencil Printers for PCB Assembly

Videos

http://www.ddmnovastar.com/stencil-printers - DDM Novastar Stencil Printers are designed for short to medium run PCB assembly. Ranging from manual to semi-automatic, these durable, easy-to-use systems provide repeatable, reliable results. Greatly r

DDM Novastar Inc

CYBERSOLV® C8622 - Safe / Effective IPA Alternative Solvent

CYBERSOLV® C8622 - Safe / Effective IPA Alternative Solvent

New Equipment | Cleaning Agents

CYBERSOLV® C8622 is a full strength solvent blend specifically designed as an IPA alternative in stencil wiping and manual bench top cleaning applications. Easy to use, C8622 is applied in applications where IPA is typically used. Safe IPA Alterna

KYZEN Corporation


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