Electronics Forum | Mon Dec 01 15:11:59 EST 2008 | grantp
Hi, The board is 412 x 685 mm. I don't really want to use a stencil taped down, as that's much worse than using one stretched over a frame, and protected from damage. It's got a lot of fine pitch, so I need to do it in a controlled way if possible.
Electronics Forum | Tue Jun 30 12:08:55 EDT 2009 | wrongway
sipad does work we used it on one assy it had a very fine pitch part on it and at that time our dek 260 wasn't up to the task along with our 8 mil stencils. we had no problems with it it was sticky enough to hold the parts on thur all smt machines.
Electronics Forum | Mon Nov 13 04:57:27 EST 2000 | Wolfgang Busko
Hi Richard, I assume that you deal with a component that has 20mil pitch. In this case depending on your pad design you get from 8 to 10mil spacing for your apertures. With a slight reduction of the aperture (10 to 15% for avoiding shorts)and a 6mil
Electronics Forum | Sat Sep 23 15:13:40 EDT 2000 | Francois Racine
Hi Sophia, I`m responsible of SMT line and we solved this problem with a complete automatic solder paste printer machine. In the past we had problem with off alignment and solder height too.... at that time we used a semi-auto printer machine and w
Electronics Forum | Sat Jun 27 10:10:23 EDT 2009 | ysutariya
I'm not in assembly, but I do know of a technology called Sipad if you are only looking to do small batches. They pre-apply the solderpaste to boards with a light adhesive, which allows you to hand-place components, even micro BGA's and fine-pitch Q
Electronics Forum | Wed Sep 20 19:34:13 EDT 2000 | Dave F
Congrats. You now control the source of almost 70% of the defects of your SMT operation. There is a neat series of presentations on printing, each year at SMI. One of the best of the SMI series was in 1997, because presenters used a common board
Electronics Forum | Tue Sep 21 13:17:29 EDT 1999 | Dave F
snip | I've often been tempted to try something a little different when specifying QFP apertures. Like, for example, using long, tapered triangular apertures arranged in alternating directions. The objective being, get the maximum amount of paste do
Electronics Forum | Fri Nov 11 09:18:28 EST 2005 | chunks
EMI shields are no fun! Your process will depend on your design and condition of the shields. We always break the shields into their own process. Because the shields are never flat, screen printing paste and trying to reflow them only caused huge
Electronics Forum | Tue Sep 18 18:36:59 EDT 2001 | mparker
... and don't forget proper stencil alignment. Invariably I find most bridging problems for fine pitch parts, etc. is caused by lousy alignment. The alignment must be verified under magnification, using the naked eye is not good enough. Use at least
