Electronics Forum: stencils for proflow (Page 10 of 44)

Need Help for CCGA Rework

Electronics Forum | Fri Nov 11 09:06:08 EST 2005 | russ

We use at least an 8mil thick stencil for these parts. The Columns do not collapse or reflow so you need to ensure plenty of solder volume for reliable attach and to make up for the coplanarity of the component itself. I assume we are not really ta

Looking for a Book/Guide for PCB assembly using SMT

Electronics Forum | Sun Jan 16 01:50:39 EST 2011 | leo83

Dear All, I am looking for a guide /book on PCB assembly using SMT(Middle range, not high speed) which i could use for selection of Machines. If their is any research report , i am ready to pay for it. Highly appreciate any inputs. Eg: What shoul

Stencil Printing for 0201 Applications

Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake

Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed

Temporary Stencil for MPC555 PBGA

Electronics Forum | Fri May 31 03:45:54 EDT 2002 | robbied

The Flextac micro stencils I mentioned are not metal, but rather laser cut polymer, so not as easily damaged. As for cost, Even if you only re-use them 5 times and not the 10 that another company I know does, they only cost around �36 for a pack of t

Printing Speeds for Fine Pitch

Electronics Forum | Wed Sep 01 06:38:37 EDT 2010 | grahamcooper22

Dear Leeg, Generally the faster your print speed the more down pressure you need on the blade to roll the paste and wipe the stencil surface clean. Pastes with higher viscosity need more pressure at slow and high print speeds. Too much pressure cause

stencil/printing machines for solder paste

Electronics Forum | Wed Feb 25 21:47:24 EST 2015 | dinhhuunam

Hi Marshall Bartel, SJ INNOTECH Printer is Best solution & Service for you ! HP-520S/HP-620S/HP-760S/HP-1000S Printing (±0.0125mm) Repeatability (±0.01mm) 0.3 Pitch QFP, 0402 Chip, Ø0.2 MBGA Speed/pressure control by printing section (5 sections) V

Stencil design for flex-rigid PWB

Electronics Forum | Wed Sep 15 22:01:34 EDT 2004 | rohman23

We've had a few problems with printing a flex-rigid PWB, and I'm hoping some of you could throw some opinions/suggestions my way. Our PWB is about 8" x 11" divided into two parts (side A & B) by 2 wide flex cables. Each of these flex cables is ab

Re: APerture size for microBGA

Electronics Forum | Fri Jun 30 10:42:24 EDT 2000 | Chrys Shea

That pad had a 16 mil dia, so I arrived at 20 mil squares by adding 2 mils to each side of the pad. Following that logic, a 12 mil pad would use a 16 mil square. But a 12 mil pad is on a finer pitch that isn't mentioned, so you should definitely

Aperature opening for epoxy printing

Electronics Forum | Fri Aug 06 03:51:06 EDT 1999 | Thomas

Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. My regular stencil manufacturer recommend the following: Thickness: 8 mils 0805 opening: Oblong 0.35 X

Temporary Stencil for MPC555 PBGA

Electronics Forum | Tue Jun 04 13:11:49 EDT 2002 | stepheno

One thing that has worked for us is to get the full size stencil for the board. Then we put a bit of paste on it, then someone holds the BGA on the other side and we apply paste to the BGA. It can be awkward. We only use this technique for if we ar


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