Full Site - : stiffening (Page 10 of 14)

Soldering PTH Card stiffeners

Electronics Forum | Tue Aug 13 12:22:03 EDT 2002 | dragonslayr

A bit of gray area for you. consider the application over the specmanship. Why are the stiffeners there in the first place? Is the rigidity requirement a high function i.e. very necessary due to potential shock and vibration , etc.? The soldering is

Re: turbulent wave restrictions

Electronics Forum | Sat May 09 11:54:12 EDT 1998 | Bob Willis

All the comments that have been made a great but I do have to say that much of the problem comes back to the design engineers not designing for manufacture. Centre board supports would have sorted the problem without jigs. | | I am running a board t

301-00030 CONNECTOR, 4 X 40, MALE, SM, 0.472 STANDOFF TOLC-140-3

Electronics Forum | Tue Jul 17 18:19:09 EDT 2001 | dave

CONNECTOR, 4 X 40, MALE, SM, 0.472 STANDOFF301-00030TOLC�Mount(1,27mm),.050",(0,64mm) .025",micro pitch Looking for someone who has had experience placing this Samtec style of connector .We are having issue with open solder and insufficent. We are no

Solder Joint Fatigue

Electronics Forum | Mon Aug 27 15:03:40 EDT 2001 | davef

Essentially, you want to ruggedize this component. Various adhesives could work great, depending on the source of the energy that is causing the solder connection fatigue. So, what are your looking to: * Rigidly bond the component to the board? * A

Reflow PBGA

Electronics Forum | Tue Oct 01 08:01:23 EDT 2002 | mjz289

WE USE A HELLER 1500 EXL OVEN (5 ZONE OVEN) AND HAVE BEEN DOING PBGAs FROM 292 TO 780 BALLS WITH .O32" PITCH (.8 mm) AND METAL STIFFENERS ON TOP WITH NO PROBLEMS. I AM GETTING 210 - 215 DEGREES C AT THE BGA BALLS WITH 50 - 65 SECONDS ABOVE LIQUIDUS

PCB wave dams

Electronics Forum | Fri Feb 27 15:48:13 EST 2004 | pdeuel

Dose anybody know of a method of preventing board sag in the wave process. We have a 2 year old Deltawave. The product we are running is a one sided 10in x 12in panel of 6 PCB's. Pin headers and connectors are near all of the edges. Our current board

BGA ball Separation

Electronics Forum | Fri Dec 02 09:51:05 EST 2005 | whippingpost

I have an assembly that uses several different BGA packages. During troubleshooting we have found that some of the balls in the corners of the BGA's are separated from the underside of the package. The PWA is approx 10�x10� and the components vary fr

PCBA flatness

Electronics Forum | Mon Mar 13 04:37:13 EST 2006 | Daniel

Hi Experts, We have requirement from our customer to control the PCBA flatness at 10 mils diagonally. Weird but this is the requirement due to the need for some through hole pins (spreaded acroos the board must touch the copper sheet while they are

Right angle PTH lead profile = blowholes

Electronics Forum | Sat Jan 19 10:56:26 EST 2008 | slthomas

Dave that's actually what I want to work on the next time we run these. Our issue with these right now is that weight distribution on the boards mandates that we break a 4-up panel into two pieces and run it 90 degrees to the ideal orientation (=s wh

Flex Circuit Fids

Electronics Forum | Mon Mar 10 20:14:20 EDT 2008 | davef

We'd be unhappy with features that are not in copper that is at the same level as the component pads, because of difficulties the fabricator would have in maintaining registration between the copper pads and the ink used for the features not in coppe


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