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ACC printing scraper (483 mm) stainless steel blade

ACC printing scraper (483 mm) stainless steel blade

New Equipment | Assembly Services

ACC printing scraper (483 mm) stainless steel blade Printing scraper features: Solder paste printer steel scraper structure is divided into: head, blade section, the blade and points: steel blade, plastic scraper pills two kinds, usually steel blade

Goodluck Electronic Equipment Co.,Ltd

Used Test Equipment Signal Generator Agilent N5183A

Used Test Equipment Signal Generator Agilent N5183A

New Equipment | Test Equipment

Agilent offers the widest selection of signal generators from baseband to 67 GHz, with frequency extensions to 500 GHz. From basic to advanced functionality, each signal generator delivers benchmark performance in its class to address the requirement

CTC Technologies Co., LTD

New development of atomic layer deposition: processes, methods and applications

Technical Library | 2020-09-08 16:43:32.0

Atomic layer deposition (ALD) is an ultra-thin film deposition technique that has found many applications owing to its distinct abilities. They include uniform deposition of conformal films with controllable thickness, even on complex three-dimensional surfaces, and can improve the efficiency of electronic devices. This technology has attracted significant interest both for fundamental understanding how the new functional materials can be synthesized by ALD and for numerous practical applications, particularly in advanced nanopatterning for microelectronics, energy storage systems, desalinations, catalysis and medical fields. This review introduces the progress made in ALD, both for computational and experimental methodologies, and provides an outlook of this emerging technology in comparison with other film deposition methods. It discusses experimental approaches and factors that affect the deposition and presents simulation methods, such as molecular dynamics and computational fluid dynamics, which help determine and predict effective ways to optimize ALD processes, hence enabling the reduction in cost, energy waste and adverse environmental impacts. Specific examples are chosen to illustrate the progress in ALD processes and applications that showed a considerable impact on other technologies.

University of Johannesburg

Surfaces of mixed formulation solder alloys at melting

Technical Library | 2022-10-31 17:25:37.0

Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]

Auburn University

TEST ENGINEER (DE1030)

Career Center | Addison,Texas, Texas USA | Engineering

RF TEST ENGINEER The selected candidate will develop test sets for testing printed circuit boards used in vhf transmitters and receivers. The ability to develop test software and hardware for automated control of test equipment, fault isolation and

Advanced Communication Solutions

Agilent 3784A-008

Agilent 3784A-008

Used SMT Equipment | General Purpose Test & Measurement

The HP 3784A is a portable error performance/jitter test set, offering standard telecom interfaces at 704 kb/s, 2, 8, and 34 Mb/s. In addition it has binary TTL/ECL interfaces for measurements up to 50 Mb/s using internal clock synthesizer.5 The HP 3

Test Equipment Connection

Agilent 8648C

Agilent 8648C

Used SMT Equipment | General Purpose Test & Measurement

The 8648C Synthesized RF Signal Generator is ideal for manufacturing high-volume products such as cordless telephones, pagers and two-way radios. Designed for semi-automated receiver test, and a variety of general purpose applications, the 8648C star

Test Equipment Connection

Agilent 8648C

Agilent 8648C

Used SMT Equipment | General Purpose Test & Measurement

The 8648C Synthesized RF Signal Generator is ideal for manufacturing high-volume products such as cordless telephones, pagers and two-way radios. Designed for semi-automated receiver test, and a variety of general purpose applications, the 8648C star

Test Equipment Connection

Agilent 83620A-001-004-008

Agilent 83620A-001-004-008

Used SMT Equipment | In-Circuit Testers

HP-Agilent 83620A-001-004-008 Sweepers Agilent 83620A-001-004-008     Model: 83620A-001-004-008     Manufactured by: Agilent         See all Agilent equipment Agilent 83620A-001-004-008 datasheet & specifications Agilent 83620A-001-004-008 d

Test Equipment Connection

Agilent 33120A

Agilent 33120A

Used SMT Equipment | General Purpose Test & Measurement

The 33120A Function / Arbitrary Waveform Generator is a high-performance, full-function 15MHz synthesized function generator. It features sine, triangle, square, ramp, and noise waveforms, a 12-bit, 40 MSa/s, 16k-deep arbrtrary waveform generator, an

Test Equipment Connection


synthesizer searches for Companies, Equipment, Machines, Suppliers & Information

Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Easily dispense fine pitch components with ±25µm positioning accuracy.
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