Electronics Forum | Thu Apr 07 11:39:48 EDT 2011 | remullis
My oven profile is 155,160,165,180,220,245,255,227 Cooling Zone 132/92. This is a 8 zone CV820 Technical Devices oven. My assy profile using Datapaq Q18 - Base on one probe feedback - Positive slope (7.09), Pos Slope Time (.45), Rise Time (1.17), Me
Electronics Forum | Fri Jun 10 13:04:04 EDT 2011 | spitkis2
Any suggestions as to what can cause a PBGA's corner to warp down during installation process on a rework system? A couple solder balls bridge at the corner. It appears at the pin 1 corner where the metal indicator of a BGA is exposed. I am wonder
Electronics Forum | Wed Aug 15 19:55:46 EDT 2012 | hegemon
If you are doing X-Ray post place and pre-reflow you should be good. Look elsewhere. Check profile - full lead free or hybrid? Be sure you are acheiving the required reflow temps and TAL required for the solder paste too. Check for belt movement
Electronics Forum | Mon Jan 21 17:59:11 EST 2013 | jorge_quijano
I had a similar situation with a very thick PCB (0.23") I could not get a TAL lower than 160 sec, I've spoken with my paste supplier about this issue and we have made some adjustments on the oven and we could lower it to 145 sec, I know it is higher
Electronics Forum | Fri Apr 04 18:16:43 EDT 2014 | garym4569
We are in the process of launching a new product and found reflow solder issue with one of the inductors. I have set oven profile to paste specifications. I just finished profiling with thermocouple under problem component. All other components ex
Electronics Forum | Fri Feb 15 15:37:35 EST 2019 | emeto
Hello, I have a capacitor that doesn't form intermetallic joint with SAC 305 solder paste.The board is ENIG. Solder melts and forms good intermetallic joint with the PCB finish. However, capacitor can be removed with physical force - it looks like a
Electronics Forum | Wed Dec 04 08:15:55 EST 2019 | proceng1
You have a peak of 216 and roughly 40 seconds TAL. So you are right in the middle of the given ranges. So there's room to get things a little hotter and for a little longer. I am surprised you are having this trouble with TIN/ LEAD, as the process
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Tue Feb 11 11:40:21 EST 2020 | emeto
Sebas, on your profile you have listed U2, U101, U102 and I was wondering if the questioned part is one of them. I attach a typical profile specs - you should follow the one for your paste. In the one you attached the slope is too fast, soak is prob
Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ
Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to
