Electronics Forum | Thu Feb 17 08:14:57 EST 2005 | davef
The issue may not be the solderability protection. It could be that the metalization on the component terminal or the metal of the component terminal was not prepared properly before the solderability protection was added.
Electronics Forum | Tue Nov 19 09:50:58 EST 2002 | GSW
Hi, Need to know if anybody has good reliability data on Sn/Bi component termination and Sn/Pb solder paste ? thanks GSW
Electronics Forum | Mon Apr 30 18:34:35 EDT 2012 | hegemon
Pure Tin terminations can be mitigated for components with solder terminations less than .030" in height from the PCB, by using 6 mil stencil with Sn63/pb37 solder paste. That's the simple story for our customers that require it. Beyond that height w
Electronics Forum | Fri Jan 15 07:23:14 EST 2021 | denism
Also, solder splashes can be due to contamination, for example, on the terminals of components. In the past, had a problem with solder splashes on a seemingly standard SMD component. The reason was the incorrect nickel plating process of the componen
Electronics Forum | Thu Apr 22 04:55:42 EDT 2004 | Richard
Have you tried using Concoat MUST II solderability tester to test on the component terminal are of good solderability. Non-wetting may occur due to oxidation or contamination on component terminal. So for immediate response to you problems is to used
Electronics Forum | Wed Jun 21 08:53:25 EDT 2006 | stepheniii
Are you worried the terminations might b oxidized? Do a dip test. If you have a solder pot carefully dip one termination of the cap into the solder. And see how well it wets. If that test doesn't satify the powers that be, then you can design a more
Electronics Forum | Mon Feb 26 14:39:34 EST 2001 | John
We are developing a new product that will have hand placed through hole parts and double sided smt. This assembly will eventually be soldered to a plastic cover that has 15 insert molded terminals. The cover extends below the surface of the board,
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Electronics Forum | Tue Aug 10 09:26:49 EDT 2004 | davef
You should be able to solder to brass - check with you flux supplier to get their recommendations. The flux you are using may not have enough activation to breakdown the oxides on the brass surface. A word of caution - brass (copper and zinc alloy)
Electronics Forum | Tue May 29 09:58:32 EDT 2007 | davef
Is the component solderable per ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires?
