Electronics Forum | Thu Jul 31 08:20:06 EDT 2008 | davef
Not quite what you'ree looking for, but may be interesting: JESD22B113, Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products http://www.akrometrix.com/industrydocs/JESD22B113
Electronics Forum | Tue Aug 26 07:44:06 EDT 2008 | davef
Industry-wide, there is no current requirement for baking of bare boards. It adds no value. * IPC-HDBK-001 has guidelines olden times. * IPC-TM-650 has several test methods to determine moisture resistance to both liquid immersion and absorption from
Electronics Forum | Thu Feb 26 15:49:48 EST 2009 | GSx
Hi I am looking for informations/specs about graphite/carbon deposited on PWB as a "spring contcat" or land (? not sure how to say in English). - Are there any Standards (IPC?)who define correct thickness of graphite ? - Are there any Test Method
Electronics Forum | Wed Jun 02 06:53:44 EDT 1999 | Earl Moon
| I need to perform shear tests on components that have been glued prior to wave soldering. Can any one recommend a shear tester and some standardized info on testing? We have had problems with poor glue bonds and would like to implement a test met
Electronics Forum | Tue Jan 10 11:51:16 EST 2006 | jax
I don't believe I have ever seen a non-destructive test for "Black Pad" that I could take back to a Fab house and collect monetary losses with... But if this test method actually does hold merit then collect away. I would like to know how this metho
Electronics Forum | Thu Mar 14 15:55:34 EDT 2024 | davef
Process Requirement Standard - J-STD-001 - Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation (test methods), frequency of testing and applicable a
Electronics Forum | Thu Jun 24 11:29:50 EDT 1999 | Matt Stump
| Hi | Could anyone tell me where i can find information, in the literature or on the Web, concerning measurements of temperature distribution, expansion, stresses in the substrate and heat sink and on the interface between them, that is all the rang
Electronics Forum | Thu Sep 26 15:28:16 EDT 2013 | joeherz
I know - A stimulating topic.... IPC-TM-650 2.3.28 method calls for a PCBA or PCB to be placed into a bag with solution, shake, analyze. Great. There is a method of doing this testing that focuses on a specific area of a PCB or a component where r
Electronics Forum | Wed Jul 03 03:02:35 EDT 2013 | autoel
How to test the reflow solder joint shear strength? What are the specification to test solder joint shear strength? What are the different methods to test the solder joint shear strength? Vijayashree
Electronics Forum | Fri Apr 26 12:35:05 EDT 2002 | blnorman
Sounds like the mask wasn't properly cured. What kind of solder mask is it? We use a photoimageable mask on our boards. The secondary cure is ~ 90 minutes @ 150�C. One of the cured mask tests is solder bath resistance where it has to resist degra
