Industry News | 2007-02-14 15:40:22.0
New ThermaSim Is First Online Simulation Tool to Use Finite Element Analysis Models for Increased Accuracy
Industry News | 2013-11-06 09:41:35.0
Indium Corporation's Sze Pei Lim, Technical Manager - Asia-Pacific Operations, will present at the SMTA Penang Expo and Tech Forum, November 8 in Penang, Malaysia.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2010-05-04 21:09:23.0
Addressing the challenges posed by traditional greases and phase-change thermal interface materials, Henkel has developed and commercialized Loctite PowerstrateXtreme Printable (PSX-P), a new print-friendly thermal management product.
Industry News | 2018-10-18 08:43:30.0
Pin-in-Paste Reflow Calculations and Special Cases
Industry News | 2010-05-11 14:53:59.0
DEK is preparing to take a whole host of innovative technologies to this year’s SMT/Hybrid/Packaging exhibition, being held in Nuremberg from 8th – 10th June 2010. Stand 7-305 will showcase DEK’s productivity-boosting solutions, from powerful print platforms through to next-generation stencil technologies and Process Improvement Products.
Industry News | 2023-03-27 14:51:47.0
We are thrilled to announce that YINCAE has some exciting news to share with you! We have recently introduced a breakthrough technology - thermal underfill UF 158A2 which can dramatically shorten the manufacturing process and improve the heat dissipation.
Industry News | 2014-04-30 13:42:31.0
Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Industry News | 2009-11-24 22:09:36.0
Screen printing and mass imaging world leader DEK chose Productronica earlier this month to launch Sentinel, a breakthrough productivity-enhancing solution that lowers the cost of achieving more good boards from the stencil printing process.
Industry News | 2008-12-15 15:28:33.0
LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.
