Product Name MFA Power（W） 0.5W,1W,2W Output Voltage(KV) ,3,4,5,6,7.5,8,9,10, DIMENSIONS： 1KV-10KV：2.50L(63.50L)X1.25W(31.75W)X0.68H(17.34H) APPLICATIONS High voltage testing PMT,MCP,radiation counter Electron Beam/Ion Beam Mass spectrome
Technical Library | 2017-01-05 16:55:11.0
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later, all major OEM and Tier 1 automotive manufacturers have converted or are in the process of converting to lead free circuit assembly processing. Starting with SAC (SnAgCu) alloys as a baseline for lead free soldering, in the last years several specific alloys were developed in order to improve resistance to high temperature creep, vibration survival and the ability to withstand thermal cycling and thermal shock.The paper compares three different solder alloys and two flux chemistries in terms of void formation and mechanical / thermal fatigue properties. Void content and reliability data of the alloys will be presented and discussed in relation to the acceptance criteria of a Tier 1 /OEM automotive supplier. As a result, a ranking list will be presented considering the combined performance of the alloys. In order to analyze the void formation and mechanical behavior of different solder alloys and flux chemistry combinations, statistical methods are used.
Industry News | 2014-01-01 20:50:49.0
Enhanced-Reliability resistors are the preferred choice in applications where stable electrical and metallurgical parameters, performance and long field life are the primary considerations. In its continuing quests to satisfy its customers who have applications that demand these types of resistors, International Manufacturing Services, Inc. (IMS) is offering Enhanced-Reliability Resistors (EnRel). These MIL-STD 202 tested resistors are qualified for thermal shock in accordance to method 107 of the Mil STD 202 and 100% DC resistance tested according to method 303 of the MIL-STD 202.
Industry News | 2021-07-13 16:24:19.0
New Vishay Intertechnology SMD HI-TMP Wet Tantalum Capacitors Save Board Space and Feature Operation to +200°C, Increased Thermal Shock Capabilities and Longer Life to 2,000 Hours
New Equipment | Rework & Repair Equipment
The BEST Epoxy Repair Kit can be used to fix damaged solder mask, damaged PCB laminate material as well as repair lifted pads and traces. 3rd party testing has shown by using the BEST 2-part epoxy, the bond strength of repair traces, pads, and lands
New Equipment | Board Handling - Storage
We have made the Rogers 4350B core pcb boards. from 2 layer to 30 layers. We have many kinds Rogers base pcb materials. RO4000® Series High Frequency Circuit Materials (ALCANTA PCB Web: alcantapcb.com) RO4000® hydrocarbon ceramic laminates
Technical Library | 2015-02-12 16:57:56.0
Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures.The aim of this study is to investigate the mechanical integrity of lead-free ball grid array (BGA) solder joints subjected to isothermal ageing at 150°C for up to 1000 hours. Upon ageing at 150°C the Sn-3.5Ag solder alloy initially age-softened for up to 200 hours. This behaviour was linked to the coarsening of grains. When aged beyond 200 hours the shear strength was found to increase up to 400 hours. This age-hardening was correlated with precipitation of hard Ag3Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. The fractured surfaces of the broken solder balls were also investigated under a Scanning Electron Microscope. The shear failures were generally due to ductile fractures in bulk solders irrespective of the ageing time.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
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Commercial-off-the-shelf (COTS) PC/104 and PC/104-Plus computer cards and components, including x86 and PowerPC CPUs; DC/DC converter power supplies and interfaces; fan cards and heatsinks; digital I/O and mass storage boards; fieldbus interfaces (C
