Industry News | 2024-02-19 12:00:05.0
Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2024, February 25‒29 in Long Beach, California.
Industry News | 2023-01-25 18:21:21.0
Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, is pleased to announce that they were once again selected by Retronix – this time for two NC25 PCB Cleaning Systems.
Industry News | 2023-11-20 15:34:41.0
Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.
Industry News | 2022-09-19 05:59:24.0
Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.
Industry News | 2022-11-28 07:00:51.0
With the development of the precision and stability of SMT equipment, the manufacturing process and testing links have gradually become the key to the development of the industry. At the same time, the fierce competition in the consumer electronics market has put forward higher requirements for the quality of electronic components. In the production process, it is necessary to use various testing technologies to inspect defects and faults in time and repair them, among these testing technologies, X-ray inspection is one of the most critical process to improve the SMT BGA QFN soldering quality.
Industry News | 2024-01-29 11:36:51.0
Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco. SPIE West is the world's premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.
Industry News | 2022-08-14 14:12:26.0
Indium Corporation® is proud to feature its cutting-edge soldering and thermal materials at SEMICON Taiwan, September 14-16, in Taipei, Taiwan.
New Equipment | Industrial Automation
Moore Automation Limited Contact: Sandy Lin mailto:unity@mvme.cn Skype: live:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Product details: 1.All product pictures are real figure, please contact us if y
Industry News | 2024-02-19 11:47:54.0
As one of the leading materials providers to the power electronics assembly industry, three Indium Corporation team members will share their insights and knowledge on a variety of industry-related topics throughout APEC 2024, February 25-29, in Long Beach, CA.
Electronics Forum | Mon Oct 03 10:41:57 EDT 2011 | patrickbruneel
Some of us here attended the 5th CALCE international symposium on tin whiskers http://www.calce.umd.edu/symposiums/ISTW2011.htm where one of my former professors, Dr. Henning Leidecker, talked about the tin whiskers he and the others at NASA Godda
