Industry News: vitronics and solder (Page 10 of 143)

IPC and SMTA Announce Keynote Speakers for High Performance Cleaning and Coating Conference

Industry News | 2010-11-04 13:44:37.0

Industry-leading associations IPC and SMTA jointly announce the keynote speakers for the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, IL.

Surface Mount Technology Association (SMTA)

IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference.

Industry News | 2018-10-11 19:15:17.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.

Association Connecting Electronics Industries (IPC)

SMTA International Conference on Soldering and Reliability Call for Papers

Industry News | 2010-01-17 22:24:09.0

Minneapolis, MN - The SMTA Technical Committee cordially invites industry professionals to submit abstracts for the 2010 International Conference on Soldering and Reliability being held this May in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

Compact Reference Manuals to IPC-A-610E and IPC J-STD-001 Illustrate Acceptance Criteria in a Handy Format for Inspectors and Operators

Industry News | 2010-09-30 00:35:51.0

The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.

Association Connecting Electronics Industries (IPC)

IPC and High Density Package Users Group Sign MoU, Strengthening Collaboration and Value to Membership

Industry News | 2020-06-24 15:45:07.0

IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.

Association Connecting Electronics Industries (IPC)

SMTA International Conference on Soldering and Reliability Program Announced

Industry News | 2010-03-03 14:33:02.0

Minneapolis, MN - The SMTA is pleased to announce the program for the 2010 International Conference on Soldering and Reliability being held May 17-20 in Toronto, Ontario, Canada

Surface Mount Technology Association (SMTA)

SMTA International Conference on Soldering and Reliability Call for Papers

Industry News | 2011-01-07 10:56:12.0

The SMTA Technical Committee cordially invites industry professionals to submit abstracts for the 2011 International Conference on Soldering and Reliability being held this May 4-6, 2011 in Toronto, Ontario, Canada. Abstracts are due by January 28, 2011.

Surface Mount Technology Association (SMTA)

International Conference on Soldering and Reliability (ICSR) Program Announced

Industry News | 2016-02-23 20:06:15.0

The SMTA is pleased to announce the program for the 10th Annual International Conference on Soldering and Reliability being held May 9-11, 2016 in Toronto, Canada. The event is co-located with the SMTA Toronto Expo.

Surface Mount Technology Association (SMTA)

SMTA International Conference on Soldering and Reliability Call For Papers

Industry News | 2008-12-15 16:20:40.0

Minneapolis, MN � The SMTA Technical Committee invites industry professionals to submit abstracts for the International Conference on Soldering and Reliability to be held May 20-22, 2009 in Toronto, Ontario, Canada. Following on the very successful events of the past two years, this conference will once again bring together the community of soldering and reliability experts.

Surface Mount Technology Association (SMTA)

IPC Workshops Highlight Updates to Key Industry Standards: IPC-A-610, J-STD-001, and IPC-A-600 and IPC-6012

Industry News | 2010-04-19 12:56:32.0

BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.

Association Connecting Electronics Industries (IPC)


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