New Equipment | Board Handling - Pallets,Carriers,Fixtures
Trade names: Ricocel Similar Wave Solder Pallet Material, Carbon Fiber Glass Reinforced Sheet Available Shapes: Sheet Color: Black Sheets Thickness: 3mm ~ 80mm Size: 1010×1010mm, 1210×1010mm About Ricocel Similar Wave Solder Pallet Material: It is
New Equipment | Selective Soldering
For flexible miniwave soldering processes and dip soldering processes that guarantee short cycle times. The high-end system which leaves nothing to be desired. Maximum Power for Your Selective Production. SEHO PowerSelective is featured with an ou
New Equipment | Solder Materials
Solder additive to aid in reducing the solder dross buildup in both static and wave soldering pots containing SN100c. AO1000 can reduce solder usage by as much as 50%. FCT Assembly has developed AO1000 Anti-Oxidant Solder Additive to aid in reducin
Industry Directory | Consultant / Service Provider / Manufacturer
EMS company Laser SMT stencils mfg Tape converting , slitting , die cut Laser modules mfg Distribution materials,components ISO 9001:2015 ISO 13485:2016 AQAP 2110:2016 EN 9120:2018
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Trade names: Ricocel Similar Wave Solder Pallet Material, Carbon Fiber Glass Reinforced Sheet Available Shapes: Sheet Color: Black Sheets Thickness: 3mm ~ 80mm Size: 1010×1010mm, 1210×1010mm About Ricocel Similar Wave Solder Pallet Material: It is
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Selective solder fixtures protect bottom side SMT components & eliminate the risk of loosing parts in the solder. Our unique designs will eliminate skipping and bridging. No need to tape areas which reduces operator time and speeds up your line.
Technical Library | 2008-03-18 12:36:31.0
This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles.
New Equipment | Solder Materials
FCT Assembly has partnered with Nihon Superior to be able to offer their patented lead free nickel stabilized tin/copper wave solder alloy- SN100C in North America. SN100C was developed to offer a technically superior and more economical option to th
New Equipment | Selective Soldering
A new entry point in cost-effective, easy-to-operate, automatic batch selective soldering. ESS310 and ESS500 Selective Soldering Machines provide easy to operate, robust systems for batch processing of mixed technology boards that require selective