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Express Newsletter: wire and bond and ceramic and pcb (Page 10 of 99)

-Pillar and BOT (Direct Bond on Substrate-Trace) Us

HALT Testing of Backward Soldered BGAs on a Military Product

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SMTnet Express - December 10, 2015

SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP Myung-June Lee

Conforming To a Higher Standard of Reliability

Defect Coverage for Non-Intrusive Board Tests

SMT Express, Volume 2, Issue No. 2 - from SMTnet.com

SMTnet Express - February 4, 2021

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Precision PCB Services, Inc

Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.

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1750 Mitchell Ave.
Oroville, CA USA

Phone: (888) 406-2830