Electronics Forum: any (Page 932 of 1647)

Re: BGA-Problems with adhesion of the solder balls

Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen

Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-

Y2K

Electronics Forum | Wed Feb 03 18:29:58 EST 1999 | Jerry Stafford

Have any of you tested or plan to test your machines for Y2K compliance. I would be interested in what you did or what you plan to do. Which machines? What parameters? It seems that it could be a career limiting move to test without getting manag

Re: electronics components suppliers

Electronics Forum | Tue Feb 23 16:55:43 EST 1999 | Joe Zuchowski

| who do you like to go to as a source of | caps, resistors, ICs, DIPs, connectors | | I'm looking for distributors. | | For I.C.'s I have had good luck with Future/FAI, Arrow, Western Resources, and Vista Mfg. Co. in K.C., Classic, Insight Cap

In-Circuit Automation

Electronics Forum | Tue Feb 02 12:43:01 EST 1999 | Rich Cary

My company produces a mixed technology control unit for automotive applications. We recently purchased an automated handler for our GENRAD in-circuit testing equipment and have encountered a challenge. We have several through hole components that,

Cracking solder joints

Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick

I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is

Re: white residue

Electronics Forum | Fri Jan 29 05:14:06 EST 1999 | Graham Naisbitt

Hi guys, I really am at a loss to understand this one. It would appear that there may be some reaction between the flux and the resist? Or maybe you have an OSP on the board that is reacting during soldering? As a fast fix, maybe you should try a

Re: ESD Work benches

Electronics Forum | Wed Jan 27 19:52:05 EST 1999 | Wayne Bracy

| How ESD will be effected by painting the legs of the work stations. Any names of suppliers? | Ali: We represent GWS work benches and their line of ESD workstations include baked on esd paint on the frames plus esd work tops. You can contact G

Re: no-clean mask for gold fingers

Electronics Forum | Wed Jan 27 11:42:50 EST 1999 | John Zisa

| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces

Re: Keepout requirements for BGAs

Electronics Forum | Mon Jan 25 13:56:45 EST 1999 | Parvez Patel

Chang Hong while developing our CSP rework process, we found a temperature spread of about 130C at a distance of approx 150 mils from the component edge. our nozzle had about 20 mils clearance from all sides of the component being reworked. depending

Board Stress

Electronics Forum | Tue Jan 19 12:25:23 EST 1999 | Mike Cox

I need some opinions (And I know everybody has one). I am mounting a board into a case, after mounting the board I am loading it with stress in the middle causing it to bend around .030 inch. The board is 4" X 6" and is Bending in the 4" direction.


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