Electronics Forum: bottom (Page 94 of 232)

Re: Wave Soldering Temperature Profile

Electronics Forum | Thu May 06 18:06:43 EDT 1999 | JohnW

| | Can anyone pls email me a typical temperature profile for wave soldering process. | | | | Thank you vey much. | | | | rdgs... | | | Typical depends on the processes you're developing. | | Key factors in my experience are flux type and requi

Re: Wave Soldering Temperature Profile

Electronics Forum | Thu May 06 18:07:59 EDT 1999 | JohnW

| | | Can anyone pls email me a typical temperature profile for wave soldering process. | | | | | | Thank you vey much. | | | | | | rdgs... | | | | | Typical depends on the processes you're developing. | | | | Key factors in my experience are f

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys

| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach

| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm

Re: PCB panellisation

Electronics Forum | Fri Apr 03 13:53:41 EST 1998 | Ron Beasley

| | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisati

Re: PCB panellisation

Electronics Forum | Sun Apr 05 14:57:10 EDT 1998 | Earl Moon

| | | | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utili

SMT Component rotation problem

Electronics Forum | Thu Feb 27 15:13:35 EST 2003 | stockley

Oh dear, I tried not to respond but i couldn't help myself. Stop me if I go off into the woods. My guess, Chris, based on your fleeting reference to GF files, is that your SMT machines are Siemens Siplace. If this is so then package orientation def

CP6 Maintenance

Electronics Forum | Thu Mar 30 12:13:10 EST 2006 | Tech

Obviously you are not as experienced as you think so I will help you out a bit.You are correct on the size of the wrench. I was trying to recall from memory but the wrench size is 8mm. The odd size I recalled came from the other side of the wrench th

Lead-Free BGA Rework

Electronics Forum | Tue Jun 26 15:28:01 EDT 2007 | hegemon

There are a lot of variables in BGA rework in general, and the switch to lead free has only magnified some of the sore spots. Perhaps with a little bit more information someone here can be of help. What is the size and thickness of the PCB? What

Wave Soldering

Electronics Forum | Thu Feb 24 00:06:00 EST 2000 | Ver Viray

Hi, Can anyone help me on how to choose profile points in wave soldering...e.g. smallest like R, C, to biggest like transformer heatsink etc.... Are the thermo-couples supposed to be on top of the pcb or at the bottom touching the solder bath when fl


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