Electronics Forum: designing (Page 94 of 537)

Solder Coverage in Non ROHS Paste

Electronics Forum | Tue Dec 21 12:11:06 EST 2021 | jseewald

You likely have raised belly pads. If possible, do a step-up on the thermal pads to compensate for the additional height of the component in this area. Some reduction/adjustment of the gullwing pads may be necessary, so be prepared for a few iterat

PCB/PCBA deflection standard

Electronics Forum | Fri Jan 28 12:34:13 EST 2022 | jseewald

Generally, a well-designed assembly should not require man-handling of the PCB to the point where it is deflecting like this. Is the housing too small? What kind of clearance do you have and is there anything you can do to alleviate the issue (clos

Juki Parallel pickup not working

Electronics Forum | Mon Aug 01 10:31:34 EDT 2022 | spoiltforchoice

I'm not familiar with the machine, but isn't a KE760L an old slow "single head, single gantry" two spindle machine? Any speedup from simultaneous picking would not necessarily be that much of an improvement. Setup as you described is the way I would

Reducing Warp after reflow

Electronics Forum | Wed Oct 19 06:46:27 EDT 2022 | winston_one

What about warpage before reflow? Often the boards with unbalanced copper can be warped initially, and you can reject it... If it's not possible to change the copper, then may be (at least for future lots) it's possible to switch to laminate with hi

Reducing Warp after reflow

Electronics Forum | Wed Oct 19 15:23:48 EDT 2022 | proceng1

I'm sorry to say, but it sounds like your bosses need a reality check. You are having a problem with the product, and it's due to bad design. Yet you can't fix the design, and can't add any time to the process to attempt to make it better. There i

GSM / universal genesis programming components that hang over the edges of the PCB (connectors)

Electronics Forum | Fri Oct 28 14:09:39 EDT 2022 | ttheis

Allowing a part to go over the board boundaries can cause collisions when boards are nested. The software on these machines has limitations but it is plenty capable and rooted in preventing physical damage to the machine. Once you are familiar with t

What were your top go-to sources for electronics information and learning in 2018

Electronics Forum | Tue Nov 06 10:28:58 EST 2018 | davef

Media Links IPC Global Insight This weekly electronic newsletter includes IPC news and multimedia information on manufacturing and management best practices and solutions, new technologies, standards, government relations and environment, health and

Re: cleaning glue off of stencils

Electronics Forum | Wed Mar 08 09:32:57 EST 2000 | Dane Stokes

We use loctite to print with before begining testing on printing we asked loctite for the best cleaning solvent for there product. loctite had there own solvent that was designed to break down the propertys of their glue mix. Contact glue supplier an

Re: Board depanelizing...

Electronics Forum | Fri Mar 03 12:11:20 EST 2000 | Keith Pelletier

I am sorry to hear your having a problem with damaged components. The machine is designed to avoid this problem. Please contact me so that I can help you with this. Regards, Keith Pelletier cab Technology

0402 components

Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann

I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.


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