Electronics Forum: solder a (Page 939 of 1481)

Re: Micro balls on gold fingers

Electronics Forum | Mon May 18 22:15:20 EDT 1998 | Steve Gregory

Howdy Richard, Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) I know it's not funny to be in that position, but there's so many different places to pick

Re: 15G PQFP

Electronics Forum | Tue Jun 02 08:30:30 EDT 1998 | Jon Medernach

I have to agree with Steve. If the problem is progessively worse the problem is the pitch conversion that was used, and I have seen it before. It may be masked by the solder paste which could be on pitch but after reflow the paste wickes to the pad

Flux Residues In Lead Free Wave Soldeing Process

Electronics Forum | Sat May 27 02:52:20 EDT 2006 | TimS

Gentlemen I have managed to pull myself together after banging my head. I am not sure the flux volume is the total solution here. All spray processes deposit flux in a similar manner, that is to say the vast majority of material sprayed onto the PCB

DPMO's

Electronics Forum | Mon Mar 01 09:14:00 EST 1999 | Jules Winfield

| I'm trying to get a feel for what the industry is doing with regards to collecting assembly defect data in the SMT/PWA process. Is it sampling or 100%? What are the points within the process where critical assembly defect data is collected. We run

Comparison between Glue & solderpaste process

Electronics Forum | Sun Jun 23 12:24:37 EDT 2002 | stepheno

I worked at a place where a customer complained that the resistance of some components was lowered. It was found to be flux entrapped from the wave solder process. The tube of epoxy, didn't have a date of manufacture, shelf life, or use by date on

Blue Haze ( Not the same as Purple Haze)

Electronics Forum | Tue Sep 03 17:48:34 EDT 2002 | dphilbrick

My customer is finding a blue haze on some SMT pads after processing, kind of looks like a water spot on the surface of solder joints. It requires 20x mag and very good lighting to see. We have done 2 different ionic tests and the boards pass to clas

Capacitor Shorts after Depaneling

Electronics Forum | Wed May 10 13:03:50 EDT 2006 | PWH

It sounds like your depaneling method is good. The only thing left to look at is to see if the depaneler is hitting the part somehow from the cutter or the bottom plates. I've seen time and time again where an operator has a part in contact with th

IEC 60601-1 Humidity Failures - No Clean Flux

Electronics Forum | Mon May 07 15:46:45 EDT 2007 | Hoss

IEC 60601-1 is a UL regulatory standard for Medical Electronic Equipment. We recently ran the humidity pre-conditioning segment of this testing and have found electromigration repeatably in areas with hand soldered joints (remaining NC flux). IEC 6

AOI Joint Inspection

Electronics Forum | Fri Oct 17 14:55:50 EDT 2008 | rway

We use a YesTech M1 system. I have been pleased with it's performance and feel it has done fairly well being that it only has one vertical camera. There are different algorithms you can use to compensate for the lack of angled cameras to catch some

Nitrogen in the Reflow Oven

Electronics Forum | Wed Oct 16 09:55:24 EDT 2013 | markhoch

Thanks guys. I can see the benefit as a CM, when you have no control over the Parts/PCBs that come in the back door. In my previous job at a CM I did often have product coming in the back door that did appear to have exceeded its shelf life, and hav


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