Electronics Forum: soldering (Page 940 of 2099)

BGA Rework

Electronics Forum | Fri Aug 25 09:12:07 EDT 2006 | russ

When not practical to drill hole into pcb to profile here is what I do and seems to be just fine. place thermo into area underneath BGA and let her rip, you will not be in the ball/solder joint, but the temp difference as long as you are in the arra

Solderality problems with SN100C Lead Free Hasl

Electronics Forum | Fri Sep 22 09:45:26 EDT 2006 | bradlanger

Greg, All the above. It looked like it was going to be a drop for SNPB HASL at first but after a few thousand boards we started running into all the problems you are describing. We first started seeing non wetting on SMT pads. The solder would wet t

Pb-Free Wave Solder Advice

Electronics Forum | Thu Sep 21 12:46:44 EDT 2006 | James

I am looking for advice on purchasing a Pb-Free Wave Solder System. No salespeople or wavemaster larry please. We are a small company with limited resources for evaluating equipment. I am hoping to get some sage advice from the experts here at SMT

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip

Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least

Soldering Iron Questions

Electronics Forum | Sun Nov 05 23:01:53 EST 2006 | Sxsxcx

ok, sorry ,750 was deg F and which I said 350~400 were deg C, I got a mistake. As I know, we use 660~720 deg F to do reworking for lead free solders such as SAC series and SnCu0.7 series solder to protect irons and components on boards. when temp.

Soldering Iron Questions

Electronics Forum | Mon Nov 06 02:56:11 EST 2006 | Loco

*We've tried the WSP80s for leadfree, also SAC. Problem with these was when they are not being used, they keep their temp and oxidate like hell. Second problem is as Russ states, the sensor is not in the tip, therefore to get the same heat in the t

Need input on cracked caps/new reflow

Electronics Forum | Tue Nov 07 18:18:03 EST 2006 | Andrea

I am wondering how to move from hand soldering our ceramic caps to doing a reflow type process. The reason for the change is too many cracked ceramic caps. I have asked our vendors to assemble our boards via reflow but because of our hardware (swaged

Question about pad pullbacks

Electronics Forum | Mon Dec 18 13:00:34 EST 2006 | realchunks

Hi John, Depending on your board, it could make a difference. Copper finishes might leave that part of the pad exposed, which is a no-no in most places. Where as a HASL board prolly won't care if you pulled the print back. On the other end, over

Automate goldfinger masking?

Electronics Forum | Sun Dec 31 07:31:40 EST 2006 | davef

Thoughts are: * Eliminate solder spotting on gold fingers through process improvement in broard handling, printing paste control, and reflow recipe development. Search the fine SMTnet Archives for previous discussions. * Dispense or print a reflow te

Wave Cassettes and Heat convection

Electronics Forum | Tue Jan 16 07:07:17 EST 2007 | tk380514

Answers: The component does take solder, no problem We get a full barrel fill with an empty PCB but only on one of the holes, the other hole has so much copper around it. The flux reached the top of the PCB when I tested the empty PCB. The IPC-A-610


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