Electronics Forum: chip (Page 95 of 261)

Re: BENT LEADS ON FINE PITCH

Electronics Forum | Fri Apr 09 15:41:11 EDT 1999 | Matt Stackhouse

| DOES ANY ONE KNOW HOW I CAN STRAIGHTEN | BENT PINS ON A FINE PITCH QFP WITH OUT DAMAGING | THE CHIP. AT $300 A CHIP I CAN'T SCRAP THEM. Here is a neat trick if you have the equipment. If your company does any feature measurement of mechanical de

Re: Chip Resistor Failure

Electronics Forum | Mon Mar 22 16:59:15 EST 1999 | B K

| Has any one seen failures of chip resistors after 1-2 years where the junction between the silver termination and the restive element on the top of the ceramic has corroded through. This results in a high resistance failure after this period of tim

Re: Wave Soldering Active Components

Electronics Forum | Sat Mar 20 00:29:07 EST 1999 | Vinesh Gandhi

| | Hi Folks, | | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the b

Re: Wafer Reflow Profile

Electronics Forum | Tue Feb 02 09:51:38 EST 1999 | Justin Medernach

| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j

Re: SMT line

Electronics Forum | Wed Apr 14 23:16:07 EDT 1999 | wil allen

| Need to know from your experience a set of smt equipment for low volume manufacturing (approx. 800K parts/yr). Types to handle are standards i.e., 0404-7343, soic's, plcc's, pqfp, tsop, soj, BGA, chip res. smt conn. | I would like to know a recomm

Re:X Y Correction at High Speed at +/- .002

Electronics Forum | Mon Dec 28 12:34:50 EST 1998 | Jon Medernach

Inorder to pick up 0402's RELIABLY correction is required in X & Y axis. Their are Chip Shooter that do this, (KME Create, and Sanyo) You can also place at +/- .002" at 43K cph with a Chip Shooter Bulk feeding is also desirable. It is not only the

Re: Help-Wire Bonding Defects Analysis After Encapsulation

Electronics Forum | Fri Nov 27 08:07:50 EST 1998 | Earl Moon

| | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is

Component Packaging Trends

Electronics Forum | Thu Oct 15 14:35:44 EDT 1998 | Joseph Belmonte

Hi Folks, As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process? Are

Re: Help with new placement equipment

Electronics Forum | Thu Oct 15 21:29:42 EDT 1998 | Scott McKee

| I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine pitch,

Re: Universal GSM

Electronics Forum | Wed Sep 30 15:06:07 EDT 1998 | Chrys

I didn't use my real name because I don't want to get bombed with phone calls and emails. We are an OEM looking to put in a SMT line soon. Is this GSM a decent machine? How much does it cost? | | Also and info on decent screen printers and re


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