Electronics Forum: designing (Page 95 of 537)

Re: Board depanelizing...

Electronics Forum | Fri Mar 03 12:11:20 EST 2000 | Keith Pelletier

I am sorry to hear your having a problem with damaged components. The machine is designed to avoid this problem. Please contact me so that I can help you with this. Regards, Keith Pelletier cab Technology

0402 components

Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann

I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.

Re: 0402 components

Electronics Forum | Thu Feb 24 12:08:13 EST 2000 | JAX

Mark, This topic has been discussed multiple time on this site. You can find almost all of them by searching the archives for tombstoning. That aside, have you look at your stencil apetures?(homeplate design).

Re: Glue a SOT223?

Electronics Forum | Wed Dec 13 20:22:37 EST 2000 | Dave F

George We use a 0.030" dot. Here's a link for aperture sizes for adhesive printing from Alpha. http://www.alphametals.com/products/techarticles/soldrpstncl/guidelines.html Here's a link for aperture sizes for adhesive printing from Heraeus. http:/

Re: BGA Inspection Criteria

Electronics Forum | Thu Dec 07 11:28:49 EST 2000 | Dason C

I hear that IPC-7095, Design and Assembly Process Implemenatation for BGAs had already release, but I am not able to find at IPC web site. Rgds. Dason

Re: BGA Inspection Criteria

Electronics Forum | Thu Dec 07 11:30:11 EST 2000 | Dason C

I hear that IPC-7095, Design and Assembly Process Implemenatation for BGAs had already release, but I am not able to find at IPC web site. Rgds. Dason

Automatic lead placement system

Electronics Forum | Thu Nov 30 11:10:36 EST 2000 | DL

Can anyone point me in the direction of where to find some lead placement equipment. Currently we have Clip leads that come in reels with solder pre attached are currently done by hand. surface mountable leads/connectors will not do, due to board/end

Re: Stencil for 10 mils IC

Electronics Forum | Mon Nov 13 16:24:49 EST 2000 | Darby

Depending on the designers pad size, I generally go for 0.010" aperture with 0.010" spacing - stencil thickness 0.005". This combo with metal squeegees and the "usual suspects" of printer set up and placement details should you you hassle free.

Re: BGA rework

Electronics Forum | Wed Nov 01 18:20:29 EST 2000 | massimo

Thank you Wolfgang, I've found something usefull in the thread, even if unfortunately nobody talks about the design of the nozzle. About the warpage, I clearly see the warpage of the corners of the BGA. To avoid it I'll keep the temperture of the nit

Re: little plastic caps: what does it all mean man!?!

Electronics Forum | Fri Oct 27 10:12:45 EDT 2000 | pr

I could be wrong but I thought they were to designate for paper or plastic feeder types.


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