Electronics Forum | Tue May 28 17:33:31 EDT 2002 | wilcoxito
We are just getting started doing BGA assembly at our plant. Any helpful hints would be greatly appreciated. My first main question is about stencils. We are considering using diamond shaped holes for the BGA pads. Does anyone have any experience
Electronics Forum | Wed May 29 00:28:11 EDT 2002 | alex_kirichenko
Hi Ben! I was in your position just over 12 months ago.. We use round appetures for BGAs and don't have any problems with it, as long as thiknes of your stencil is correct. As for baking BGAs befor placing. I haven't had any problems with devices
Electronics Forum | Wed Jun 12 11:11:50 EDT 2002 | davef
J-STD-001 guideline of 1000 lm/m^2 [93 fc] seems high, but it is the minimum level of illumination that operators and inspectors should have to perform their tasks. IESNA LPD Architectural Recommendations Type of Facility||General Area percent / fc
Electronics Forum | Fri Jun 28 03:04:21 EDT 2002 | Dreamsniper
Forgot to include the following: Dwell time is from 55 secs to 68 secs. Indium specs for the paste is maximum peak @ 228'C and 30 to 90 secs dwell time above 183'C. PCB is a 6 layer board with Dimension of 205 x 166 mm but is slightly dense with 11
Electronics Forum | Thu Sep 12 15:23:06 EDT 2002 | soupatech
I amusing a Fuji CP3. The part data seems to be the easiest part for me, 3x3 square. I went with the 2mm and had LOTS of dropped parts. A 1.3mm worked MUCH better, between 1 and 2% loss. My only problem now seems to be profiling the oven. The specs o
Electronics Forum | Thu Sep 19 16:46:45 EDT 2002 | dragonslayr
There are never stupid questions - only stupid answers. More detail is needed to be helpful for your answer. Yes, there are ways it can be done - depending on the application, practicality and expense. What is it that you are trying to power with 1
Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.
unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-
Electronics Forum | Thu Oct 31 08:02:12 EST 2002 | davidweir
we are looking at buying an screen printer and are curretly have an mpm up1500 and dek ela on the shortlist both silimar spec's except mpm has automatic tooling. being a cem having to change set up a number of time a week quick change over is a co
Electronics Forum | Thu Jan 02 15:32:26 EST 2003 | Mark
Hello. Sometimes metal squeegees DO work with stepped stencils. You will always get much better results with metal squeegees compared to polymer blades. The only requirement for the metal squeegee to work, you need about 0.06 in clearance for eve
Electronics Forum | Fri Dec 06 10:16:57 EST 2002 | davef
Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acceptable" cleanliness varies between specification and from company to company.
