Electronics Forum: soldering (Page 942 of 2099)

Mix Technology Board Processes

Electronics Forum | Fri Apr 27 08:58:49 EDT 2007 | ck_the_flip

There are several pallet manufacturers, Ascentec Engineering, Pentagon EMS, and S&P Engineering - to name a few - that make titanium inserts for wave pallets. These inserts (inserted into your delmat or CDM material) will act as your pockets to mask

Reflow oven profiling - frequency ???

Electronics Forum | Thu Apr 26 09:05:16 EDT 2007 | realchunks

Hi D0m0 Can you standardize on your temps and just adjust conveyor speeds for various sizes of the boards? Another trick is to parallel t-couple plug off the actual t-couples of the oven and mount the plug in an easy access point of the oven. The

Time above liquidus

Electronics Forum | Fri May 25 13:38:15 EDT 2007 | mfgengr

TAL Too Long - dull solder joints, dewetting. TAL Too Short - cold solder, insufficient wetting. You want TAL to be as short as possible (but not lower than 30 seconds), but long enough for every solder joint to be above TAL for at least 30 seconds.

soulder SMT Mat

Electronics Forum | Wed May 16 11:40:11 EDT 2007 | stepheniii

I test pdb-boards on the mat it ain't work! Wrong > mount of bolts being outputted. is have something > to do witfh the rohas soulder on them? I will take a stab at translating. I test PCBs on a static mat but the test does not work. The output

Rosin vs. Resin Flux

Electronics Forum | Thu May 31 11:26:33 EDT 2007 | gsala

Tnks Patrick, additional infos..... we are just playng with different NC solder wires L-F, the best results in terms of solderability (faster solder flowing, holes filling up) it seams are coming from an ROM1, as we know, according to J-STD-004, or

IEC - 60601 compliant LF-NC Wire Solder

Electronics Forum | Mon Jun 04 18:23:41 EDT 2007 | greggc09

Patrick Q1) Is the test pattern similar to the IPC-B-25? A1) - No - Tests were run on a prototype assembly. Q2) what is the temperature in the test chamber and voltage supplied to the test coupons? A2) 25C with 3.3VDC. Q3) Does this test i

Questions on underfill process

Electronics Forum | Fri Jun 08 07:52:13 EDT 2007 | zanolli

We are looking at a specialized method of direct soldering ceramic circuit modules (maybe 40mm square) to a mother board with solder joints on only 2 of the 4 sides. These modules would be oriented horizontally, or mezzanine like, to the mother board

Kester R562 and using lead free components

Electronics Forum | Fri Jul 06 13:44:15 EDT 2007 | shrek

Krikies! seems like a head-scratcher if I may say so me-self. I would say the other ogre is right, that surface finish will play a big factor in your solder joint's grain structure or how shiney 'tis. Non-HASL bearing finishes will typicaly exhibit

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 09:27:15 EDT 2007 | losersk8er

Sorry I have just started working in this industry so I am not as familiar with everything. The probelm is with the Product shorting because of small pieces of metal stretching accross two leads of an IC. This could be a result of faulty equipment?

lead free components in leaded process

Electronics Forum | Thu Jul 19 11:59:21 EDT 2007 | hussman

Phil is wrong. In the real world, we know that part mfgers have not changed every one of their parts to make them "high temp". They just changed the plating. Anyone who thinks otherwise, has never run a profile or touched a warm board coming out o


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