Electronics Forum | Thu Apr 17 10:44:24 EDT 2008 | rculpepp
I'd suspect contamination also, possibly from the board supplier. Sr. Tech's post mentioned what looks like a blister on the board, in the upper right of the Q19 photo. This could very well be a contaminate from the PWB fab shop. I've seen similar pr
Electronics Forum | Thu Oct 27 06:05:50 EDT 2022 | angela t
SMT chip processing short-circuit bad phenomenon mostly in the fine pitch IC pins, mostly in the 0.5mm and the following pitch between the IC pins, because its spacing is small, improperly designed template or printing a slight omission is very easy
Electronics Forum | Sat Jul 17 13:25:02 EDT 1999 | Scott
| | | | | | I need a good chemical to remove the lacquer finish off of magnet wire. I know there are different kinds but I need one that really works. Any suggestions would be great. thanks in advance guys. | | | | | | | | | | | What is it you're tr
Electronics Forum | Wed Aug 18 09:41:47 EDT 2010 | namruht
Are you controlling humidity in your plant? I'm > not familiar with that particular paste, but some > pastes are sensitive to a humid environment. We > also had one paste supplier send us a batch that > had excessive solder balls if the boards
Electronics Forum | Thu Sep 24 12:59:59 EDT 2020 | davef
If whatever is preventing the leads on your component from wetting is oxidation, cleaning the component will not help. Consider trying a more active flux prior to soldering. Understand from your supplier the potential complications that may affect
Electronics Forum | Tue May 03 15:15:33 EDT 2005 | dphilbrick
The biggest problem is getting paste on the board. We ran a board that had 8 per and would get an occasional insufficient solder joint. I would look into doing the boards with something like a SiPad process (www.sipad.net) My $0.02
Electronics Forum | Wed Apr 19 07:45:50 EDT 2006 | Carol Stirling
Sorry about that. I'd like to post a picture but doubt it's possible. Baseball cap = The pad solder reflows but the BGA ball and the pad don't reflow together in a continuous elliptical shape. Carol
Electronics Forum | Fri Nov 21 09:29:11 EST 2008 | saintete1304
Hi , i desire to find the type of information : When the Soldering must be performed after baking for the PWB to not have a POP problem link to the moisture ? And the time for a flexible PWB ? thanks best regards
Electronics Forum | Fri Apr 20 21:16:29 EDT 2018 | sarason
And if it is a hard rubber nozzle for a large IC make sure it is still pliable. And solder paste isn't stuck up the end of your nozzle sarason
Electronics Forum | Tue Apr 20 20:11:58 EDT 2004 | davef
First, how oxidized are these solder balls? Will the take solder using your routine flux / paste? Second, on restoring solderability, the three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinn
