Electronics Forum | Fri May 25 13:38:15 EDT 2007 | mfgengr
TAL Too Long - dull solder joints, dewetting. TAL Too Short - cold solder, insufficient wetting. You want TAL to be as short as possible (but not lower than 30 seconds), but long enough for every solder joint to be above TAL for at least 30 seconds.
Electronics Forum | Wed May 16 11:40:11 EDT 2007 | stepheniii
I test pdb-boards on the mat it ain't work! Wrong > mount of bolts being outputted. is have something > to do witfh the rohas soulder on them? I will take a stab at translating. I test PCBs on a static mat but the test does not work. The output
Electronics Forum | Thu May 31 11:26:33 EDT 2007 | gsala
Tnks Patrick, additional infos..... we are just playng with different NC solder wires L-F, the best results in terms of solderability (faster solder flowing, holes filling up) it seams are coming from an ROM1, as we know, according to J-STD-004, or
Electronics Forum | Mon Jun 04 18:23:41 EDT 2007 | greggc09
Patrick Q1) Is the test pattern similar to the IPC-B-25? A1) - No - Tests were run on a prototype assembly. Q2) what is the temperature in the test chamber and voltage supplied to the test coupons? A2) 25C with 3.3VDC. Q3) Does this test i
Electronics Forum | Fri Jun 08 07:52:13 EDT 2007 | zanolli
We are looking at a specialized method of direct soldering ceramic circuit modules (maybe 40mm square) to a mother board with solder joints on only 2 of the 4 sides. These modules would be oriented horizontally, or mezzanine like, to the mother board
Electronics Forum | Fri Jul 06 13:44:15 EDT 2007 | shrek
Krikies! seems like a head-scratcher if I may say so me-self. I would say the other ogre is right, that surface finish will play a big factor in your solder joint's grain structure or how shiney 'tis. Non-HASL bearing finishes will typicaly exhibit
Electronics Forum | Fri Jul 13 09:27:15 EDT 2007 | losersk8er
Sorry I have just started working in this industry so I am not as familiar with everything. The probelm is with the Product shorting because of small pieces of metal stretching accross two leads of an IC. This could be a result of faulty equipment?
Electronics Forum | Thu Jul 19 11:59:21 EDT 2007 | hussman
Phil is wrong. In the real world, we know that part mfgers have not changed every one of their parts to make them "high temp". They just changed the plating. Anyone who thinks otherwise, has never run a profile or touched a warm board coming out o
Electronics Forum | Tue Jul 24 10:23:36 EDT 2007 | ck_the_flip
Michelle, Traditionally, the adhesive side is always run first since most designers put passives (resistors, caps) on the adhesive (solder side) of the board. I worked in an environment where we did the adhesive side first, sometimes the boards "sa
Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
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