Electronics Forum: chip (Page 95 of 260)

Re: Wafer Reflow Profile

Electronics Forum | Tue Feb 02 09:51:38 EST 1999 | Justin Medernach

| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j

Re: SMT line

Electronics Forum | Wed Apr 14 23:16:07 EDT 1999 | wil allen

| Need to know from your experience a set of smt equipment for low volume manufacturing (approx. 800K parts/yr). Types to handle are standards i.e., 0404-7343, soic's, plcc's, pqfp, tsop, soj, BGA, chip res. smt conn. | I would like to know a recomm

Re:X Y Correction at High Speed at +/- .002

Electronics Forum | Mon Dec 28 12:34:50 EST 1998 | Jon Medernach

Inorder to pick up 0402's RELIABLY correction is required in X & Y axis. Their are Chip Shooter that do this, (KME Create, and Sanyo) You can also place at +/- .002" at 43K cph with a Chip Shooter Bulk feeding is also desirable. It is not only the

Re: Help-Wire Bonding Defects Analysis After Encapsulation

Electronics Forum | Fri Nov 27 08:07:50 EST 1998 | Earl Moon

| | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is

Component Packaging Trends

Electronics Forum | Thu Oct 15 14:35:44 EDT 1998 | Joseph Belmonte

Hi Folks, As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process? Are

Re: Help with new placement equipment

Electronics Forum | Thu Oct 15 21:29:42 EDT 1998 | Scott McKee

| I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine pitch,

Re: Universal GSM

Electronics Forum | Wed Sep 30 15:06:07 EDT 1998 | Chrys

I didn't use my real name because I don't want to get bombed with phone calls and emails. We are an OEM looking to put in a SMT line soon. Is this GSM a decent machine? How much does it cost? | | Also and info on decent screen printers and re

Epoxy Cracked & Capacitor Cracked

Electronics Forum | Wed Sep 09 21:20:26 EDT 1998 | Simon Ting

hi, 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of epoxy,

Re: Epoxy Cracked & Capacitor Cracked

Electronics Forum | Thu Sep 10 09:47:15 EDT 1998 | Earl Moon

| hi, | 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. | We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of e

Re: Surface mount on perf board

Electronics Forum | Wed Sep 02 17:29:51 EDT 1998 | Dave F

| How would you mount a surface mount chip onto Perf board? I am doing a project for school and one of the chips is a surface mount, but everything else fits in Perf board. Any suggestions? Thanks Matt: Here's one way to do it: 1 Get a hot glue


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