Electronics Forum: designing (Page 95 of 537)

Re: 0402 components

Electronics Forum | Thu Feb 24 12:08:13 EST 2000 | JAX

Mark, This topic has been discussed multiple time on this site. You can find almost all of them by searching the archives for tombstoning. That aside, have you look at your stencil apetures?(homeplate design).

Re: Glue a SOT223?

Electronics Forum | Wed Dec 13 20:22:37 EST 2000 | Dave F

George We use a 0.030" dot. Here's a link for aperture sizes for adhesive printing from Alpha. http://www.alphametals.com/products/techarticles/soldrpstncl/guidelines.html Here's a link for aperture sizes for adhesive printing from Heraeus. http:/

Re: BGA Inspection Criteria

Electronics Forum | Thu Dec 07 11:28:49 EST 2000 | Dason C

I hear that IPC-7095, Design and Assembly Process Implemenatation for BGAs had already release, but I am not able to find at IPC web site. Rgds. Dason

Re: BGA Inspection Criteria

Electronics Forum | Thu Dec 07 11:30:11 EST 2000 | Dason C

I hear that IPC-7095, Design and Assembly Process Implemenatation for BGAs had already release, but I am not able to find at IPC web site. Rgds. Dason

Automatic lead placement system

Electronics Forum | Thu Nov 30 11:10:36 EST 2000 | DL

Can anyone point me in the direction of where to find some lead placement equipment. Currently we have Clip leads that come in reels with solder pre attached are currently done by hand. surface mountable leads/connectors will not do, due to board/end

Re: Stencil for 10 mils IC

Electronics Forum | Mon Nov 13 16:24:49 EST 2000 | Darby

Depending on the designers pad size, I generally go for 0.010" aperture with 0.010" spacing - stencil thickness 0.005". This combo with metal squeegees and the "usual suspects" of printer set up and placement details should you you hassle free.

Re: BGA rework

Electronics Forum | Wed Nov 01 18:20:29 EST 2000 | massimo

Thank you Wolfgang, I've found something usefull in the thread, even if unfortunately nobody talks about the design of the nozzle. About the warpage, I clearly see the warpage of the corners of the BGA. To avoid it I'll keep the temperture of the nit

Re: little plastic caps: what does it all mean man!?!

Electronics Forum | Fri Oct 27 10:12:45 EDT 2000 | pr

I could be wrong but I thought they were to designate for paper or plastic feeder types.

Re: 16 mil pitch QFP solder bridge

Electronics Forum | Mon Oct 09 19:56:41 EDT 2000 | Dave F

CJ: Arturo and the others make good suggestions. Consider: IPC-7525 Stencil Design Guidelines

ATEC

Electronics Forum | Fri Oct 06 10:52:16 EDT 2000 | Glenn Brash

We have officially launched our Sept 2000 Microelectronic Design program. Our students will be starting there internships in Sept 2001. We are now receiving applications for our May 2001 program. Should you be interested in offering internship or


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