Electronics Forum | Mon Jun 19 02:46:34 EDT 2000 | Manohar Singh
We have Fuji IP3 Machine with SMD3 Vision system. We are in an attempt to place BGA on the PCB with IP-III. The BGA is a 256 Pin, the ball size on device is minimum-25 mils, maximum-35 mils, PCB pad size is 32 mils. We don't have any specific inspect
Electronics Forum | Fri May 05 20:07:26 EDT 2000 | TNT
Charles, The percentage of misplaced components can increase with the number of components, because as you increase the number of placements the travel of the PCB,for a fixed turret machine, increases in table speed and distance. The slower the trav
Electronics Forum | Wed Apr 26 22:34:49 EDT 2000 | Eric Chua
1. Verify all the part had load to machine. Get ready for the profile. 2. Run the board with double side tape. Is better to run one board for each machine. 3. Verify all the placement ( missing, misalgnment,etc )and check the value using meter for a
Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper
Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and
Electronics Forum | Thu Feb 17 16:55:50 EST 2000 | Brian Husnik
I am evaluating the purchase of a used SRT Rework Station, Model # 'FPD-W', and would like to hear from anyone who has any experience, thoughts, comments or suggestions regarding this station. We will be using the station for removal and placement o
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Tue Feb 06 18:12:46 EST 2001 | davef
Pete makes great points. Taking a slightly different angle, use your placement equipment's software to help you. It keeps track of the number of picks and attempts for each location. Study these numbers for a week and determine the capability of p
Electronics Forum | Fri Jun 15 09:16:46 EDT 2001 | adam
Thanks Dave. About your second comment, the issue is placing BGA connectors mirror image (male, and female), the connector sometimes shifts during placement before reflow. we are using a six mil stencil for both sides with minimum paste deposit. a
Electronics Forum | Thu Jul 05 10:45:01 EDT 2001 | dougie
Steven, There is a load of info on this if you check through the archives. Quick pointer though are: Solder balls are caused by paste creeping under the component at placement. The part is placed and the paste is squashed under the component, when t
Electronics Forum | Tue Dec 28 09:36:34 EST 1999 | Dan Woodward
Certainly automatic placement, preferably with vision system assistance will yield a more repeatable process. Process repeatability (paste deposition, connector placement, reflow cycle, etc.) will be your key to success here. Another possibility yo
