Electronics Forum: soldering (Page 944 of 2103)

Questions on underfill process

Electronics Forum | Fri Jun 08 07:52:13 EDT 2007 | zanolli

We are looking at a specialized method of direct soldering ceramic circuit modules (maybe 40mm square) to a mother board with solder joints on only 2 of the 4 sides. These modules would be oriented horizontally, or mezzanine like, to the mother board

Kester R562 and using lead free components

Electronics Forum | Fri Jul 06 13:44:15 EDT 2007 | shrek

Krikies! seems like a head-scratcher if I may say so me-self. I would say the other ogre is right, that surface finish will play a big factor in your solder joint's grain structure or how shiney 'tis. Non-HASL bearing finishes will typicaly exhibit

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 09:27:15 EDT 2007 | losersk8er

Sorry I have just started working in this industry so I am not as familiar with everything. The probelm is with the Product shorting because of small pieces of metal stretching accross two leads of an IC. This could be a result of faulty equipment?

lead free components in leaded process

Electronics Forum | Thu Jul 19 11:59:21 EDT 2007 | hussman

Phil is wrong. In the real world, we know that part mfgers have not changed every one of their parts to make them "high temp". They just changed the plating. Anyone who thinks otherwise, has never run a profile or touched a warm board coming out o

Adhesive printing with double side board

Electronics Forum | Tue Jul 24 10:23:36 EDT 2007 | ck_the_flip

Michelle, Traditionally, the adhesive side is always run first since most designers put passives (resistors, caps) on the adhesive (solder side) of the board. I worked in an environment where we did the adhesive side first, sometimes the boards "sa

PWAs & PWBs bake out requirements

Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef

Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to

Solder voids in PTH

Electronics Forum | Sun Aug 19 15:34:20 EDT 2007 | davef

What are you trying to do: * Improve hole fill? * Reduce PTH voiding? Hole fill: Search the fine SMTnet Archives for stuff like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=36063 PTH voiding: Ideally, there are no voids. We're unawar

Wave Solder Pallets - Lead Free

Electronics Forum | Thu Aug 23 08:31:09 EDT 2007 | ck_the_flip

Dave, that's good thread, but I think Mike is more concerned with the Titanium inserts that pallet manufacturers often use to overcome sh*tty designs - like the ones where they put a Through-hole 2mm away from a SMT pad. He's not so concerned about t

solder void in oscillator joint

Electronics Forum | Tue Sep 04 10:27:33 EDT 2007 | rgduval

I haven't experienced this problem, exactly, but I have had issues with noise in digital circuits that appear to have gone away with touch up. The problem was that the customer blamed the noise issue on the solder quality, and he pointed to the fact

Solder Joint Strength Comparison

Electronics Forum | Wed Sep 05 10:59:02 EDT 2007 | slthomas

What's sad is, it really happened. I won't bore you with the details again. ;) Lloyd, I would love to have a nice Hi Scope too (I think Cchunks works for one of those big champagne and caviar corporate entities ;)) but if you can't swing it, at leas


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