Electronics Forum | Wed Jan 11 08:27:35 EST 2006 | davef
MSK As GS told you in an earlier posting, J-STD-002 and IEC 68-2-69 describe methods and equipment for component solderability testing. Go get a copy of either one. The primary component solderability test methods are: * Dip and look method * Wett
Electronics Forum | Tue Jan 10 12:17:17 EST 2006 | Rob
Hi, The ROHS compliant parts are usually Matte Tin on the outer terminal plating. There are also 2 further types of metal on the average chip cap - the undercoat metal of the outer electrode & the inner electrode. These are usually the same & are
Electronics Forum | Mon Jan 16 09:15:40 EST 2006 | russ
I can't see why it would be any different, You are melting the balls into reflow to the pad. In my opinion, paste is only useful in this situation to keep the part on the board during placement along with some planarity concerns in some instances.
Electronics Forum | Thu Jan 19 13:53:06 EST 2006 | sarar
Hey guys - our lab has some data and photographs available for the MS2 for use in wave solder from some of the studies we have performed for P Kay. There are other versions being studied, but that is the only version available to market currently.
Electronics Forum | Tue Feb 14 09:35:25 EST 2006 | Baer
Let me give some information on the use of MS2. The average wave solder machine will use one liter per five day week per 8 hour shift. The usage can vary + or - 20%. Instead of removing 6 to 10 Lbs of dross every 3 hours you will have to remove 100 M
Electronics Forum | Fri Feb 17 14:54:45 EST 2006 | Baer
We have a great deal of new reliability data and we are preparing a full document that shows the statistically valid reduction in solder related defects as well as the improved throughput. It will include all of the SIR test results which are all goo
Electronics Forum | Tue Dec 26 21:28:56 EST 2006 | generalrp
Hello! About Dross reducing(recycle)everyone can check the following patent. US PATENT # 616,161 1898 year!!!! Also, from the contemprorary patents, US PATENT # 6,942,791 and some others. If using MS2 molten solder surfactant, every week you wi
Electronics Forum | Tue Jan 17 11:19:34 EST 2006 | Kris
Amol, RoHS does not apply to BGA on their own. Depends where they go in ? DVD player vs server board There is "solder exemption" for certain product applications. SnPb ball BGA can used with tin-lead solder on server/infrastructure/switch telecom
Electronics Forum | Tue Jan 24 04:09:27 EST 2006 | aj
Hi all, I would like to hear from more experienced selective wave pallet users out there. If you do not use a selective wave pallet does this not leave the possibility of solder flowing up thru the Via's on the board. I have identified this as been
Electronics Forum | Fri Jan 27 17:23:10 EST 2006 | muse95
Watch the solder profiles allowed for these caps. Most electrolytics cannot withstand high heat. Even RoHS compliant Electrolytics are often rated for peak 245C, 3 secs max, for example. Nowhere close to the 260C 10-20 sec you usually like to see.
