Electronics Forum | Tue May 09 18:30:35 EDT 2006 | muse95
I can understand the theory behind fewer tombstones with SAC. If people were having tombstone problems with SnPb eutectic solder, often switching to Sn62Pb36Ag2 would improve it, because with the addition of some silver, a small plastic zone in the
Electronics Forum | Fri May 12 13:56:37 EDT 2006 | timnop
Steve, Thank you very much for your reply. What I really need to know now is how you discovered these issues. Did you run this product in your wave solder machine, and for how long? Are you now using SN100c instead? Please mention the other issues if
Electronics Forum | Thu May 18 09:17:25 EDT 2006 | patrickbruneel
Stephen, In addition to your comments The bothersome part is that NO environmental impact assessment report commissioned by the EU on the environmental impact of lead in solders and its alternatives exist. The two environmental impact reports that
Electronics Forum | Mon May 15 10:16:36 EDT 2006 | slaine
Hi Im trying to find a supplier for 30swg HMP solder wire idealy the alloy I want is 93.5Pb, 5Sn, 1.5Ag, 296 to 301 degrees C. Flux cored. 30swg or 0.3mm diamiter. but the critcal parts are the diameter and the melting point, 300 degrees +-20 degree
Electronics Forum | Sun May 21 19:18:52 EDT 2006 | grantp
Hi, I think you should be ok, as the contamination in a reflow oven is generally flux from what I have seen. I have never heard to the solder metals itself being inside the oven apart from some paste in hole we did that sometimes dropped a bit of so
Electronics Forum | Wed May 17 12:08:04 EDT 2006 | Mark
Hello, I have recived from customer PCB where he found that big SMD electrolytic capacitor just fell off. I checked this boards (FR4 , Au/Ni coating). I noticed that all solder remained on the termination of capacitors and looks ok but on the boar
Electronics Forum | Wed May 17 13:07:09 EDT 2006 | Chunks
I would suspect touch-up/repair, unless all your caps are falling off. I know our operators use two irons to solder both sides at the same time. If it's not flay and square, yo may get the defect you are talking about. Another area is co-planari
Electronics Forum | Thu May 18 11:27:36 EDT 2006 | patrickbruneel
I'm not on the production floor on a daily basis like the other guys here but here's my 2 cents: With a Ni/Au plating the inter-metallic that needs to be formed is Ni/Sn. Ni/Sn inter-metallic requires higher peak assembly temperature and a longer dwe
Electronics Forum | Fri May 26 10:17:21 EDT 2006 | pjc
Here are settings for a Vitronics SMR500 oven for Indium Corp. 5.1 No-Clean Pb Free solderpaste, the product profiled was of medium thermal mass: RTS, Temp C 120, 170, 195, 248, 264, conveyor speed was 43cm/min (17"/min.) Peak temps were reached in
Electronics Forum | Mon Jun 05 14:35:17 EDT 2006 | marc
Yes.... stop checking on your process.... :) Seriously...if you cleaning the boards after I would suspect no issues. If your leaving the flux on the board (I suspect they are using quite a bit) then I would be concerned. Since the boards have al
