Electronics Forum | Thu Apr 03 17:39:37 EDT 2014 | siddharth
You are correct. Both the machines are "semi-automatic". The program can focus on the part you want to inspect and perform basic inspections like void analysis (BGA, QFP) etc. But you have to manually navigate and look for defects like TH solder fill
Electronics Forum | Thu Apr 03 17:50:53 EDT 2014 | rboguski
We use it almost exclusively in manual mode for PCBA failure analysis. Our main purpose is to find head-in-pillow defects; secondarily incomplete wetting of ball to substrate. In two years of almost continuous use we have only had occasion to use t
Electronics Forum | Fri Apr 04 13:03:00 EDT 2014 | jyo_409
What is the inspection procedure How to test leakage current Is 100% checking is required at IGI inspection What is the shelf life of the capacitor How much period shelf life is recommended for these capacitors How to check the ripple current of thes
Electronics Forum | Tue Apr 15 11:58:20 EDT 2014 | superlen
Sarason, I will send you some samples. Note, however the .pcb file has a LOT more information in that just placement data, it has vision code definitions, part specific fields such as number of pick retrys, pickup/placement delays, speeds, feeder xy
Electronics Forum | Mon May 12 13:55:19 EDT 2014 | hegemon
It sounds like a bit too much solder on the PWB, caused by too large a pad for the lead it will contain. In that case solder reduction is the way to move forward. What are the options there? 1. New stencil or stencils - (not desirable) 2. Increas
Electronics Forum | Sat May 17 10:38:49 EDT 2014 | sarason
I hate to say this but in all probability this wont work. I have built real strain gages and they depend on the change(Co-effiecent) of resistence with strain(or Stretch). since you are connecting you elements up with copper wire it will frm part of
Electronics Forum | Tue May 20 18:38:23 EDT 2014 | hegemon
From the picture I would say the problem lies with the PWB manufacturer. It looks as though some part of the plating process was not optimal during the PWB production run, and you have the resulting discoloration following the reflow process. What
Electronics Forum | Wed Jun 18 18:58:10 EDT 2014 | ke6zoy
Hi All, We leadform components for our assemblies in house and have been tinning the leads using a dip methood by hand into a solder pot. by just handling the components during the tinning and cleaning process we are at times damaging the parts/lea
Electronics Forum | Sat Jun 28 07:19:32 EDT 2014 | sramos
Based on your knowledge and experience, could you tell me about speed differences when placing a mix of SMD at mass production? We could consider packages like the small R & C chips, then SOD323, SOT-23, SOT-23-5, SOT23-6, SON6, QFN8, SOIC-8, SOIC-16
Electronics Forum | Sun Jun 29 02:50:37 EDT 2014 | alexeis
Hi, The issue is very complex and difficult to arbitrarily divide the types of components. From research we perform today together with our customers to design a work-at-SMT accurate as much as possible, I can summarize that vast time differences de
