Electronics Forum | Thu Jun 12 08:01:07 EDT 2008 | mmjm_1099
Your best bet is do your homework and read all the material about lead-free. IPC home page is your best site to visit.
Electronics Forum | Thu Jul 10 22:34:34 EDT 2008 | davef
We wouldn't get our underware in a knot about poor wetting on a lead that is not connected to the board. IPC standards seen to say that the inspector should use common sense in interpreting standards requirements. Then again, it's not all that common
Electronics Forum | Fri Jul 11 02:42:40 EDT 2008 | aj
Thanks Dave, IPC-6012 states min at 0.05um. Has this been a update or is it for a different class? thanks, aj...
Electronics Forum | Fri Aug 01 08:10:29 EDT 2008 | scotceltic
Has anyone come across a standard or study (JEDEC, IPC) where it has the recommended shelf life outside of a dry box for immersion silver coated PCB's to prevent oxidation from affecting the soldering process (Both reflow and Wave). I know it will
Electronics Forum | Tue Aug 12 13:22:17 EDT 2008 | bschreiber
A copy of the IPC-7526 "Stencil and Misprint Cleaning Handbook" is available as a free download at: http://www.smartsonic.com/article.html Regards, Bill Schreiber Smart Sonic Stencil Cleaning Systems www.SmartSonic.com
Electronics Forum | Thu Aug 14 18:13:21 EDT 2008 | pms
See them funky via pads ?? What's your opinions ? Junk or acceptable ?? Anyone know of an IPC manual that has pics and standards of defective and acceptable PCB's ?? Thanks
Electronics Forum | Tue Aug 26 03:48:44 EDT 2008 | eyalg
Does anyone know if the IPC 610 standard call for baking bare boards (PWB) prior assembly? Note: I am talking about bare boars only and NOT plastic packages components, Regards. Eyal Green
Electronics Forum | Wed Sep 03 16:15:30 EDT 2008 | blnorman
Elemental is by SEM/EDX. The brown coloration does resemble the 3 micron photo. Again, if I'm picking up copper (our Ag plating thickness requirements are 0.05 micron to 0.12 micron following IPC 4553), maybe we do have a porous silver plating.
Electronics Forum | Tue Sep 02 22:21:26 EDT 2008 | davef
IPC-6012 Table 3-2. States "Fused tin-lead or solder coat - Coverage and Solderable". The lack of any specific dimension criteria doesn't make this any less a requirement. There must be complete coverage of solder on the land, and it must be wettable
Electronics Forum | Thu Nov 06 15:26:55 EST 2008 | mrmaint
IPC only allows 25% max voiding. We are able to run at levels much lower than 25% by using a heller 1800 reflow oven. Have not been able to eliminate voids completly. Not even the worst case have we been above 20%.
IPC is the trade association for the printed wiring board and electronics assembly industries.
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