Electronics Forum | Tue Apr 01 12:52:34 EDT 2008 | pstone
Thanks for the insight. Most boards we are seeing problems with are 1.60mm thick (some less) and most of them are panelized. For your support pins what do you use to show operators where the pins should be setup? I have heard of using Plexiglas to m
Electronics Forum | Thu May 01 16:41:54 EDT 2008 | chrisawallace
At my last company, we sent specific key components out for remarking to help protect our intellectual property as it is much more difficult to copy a design if you don't know what the components are. (Yes, I understand this is not foolproof but rath
Electronics Forum | Sat May 17 13:20:46 EDT 2008 | sarason
Jon, I tried to compile your code, but had to make 2 changes for happy compilation under Borland C++ Builder. Specifically: #include void outNum(double RealNum, long SigFrac) Now the question, could you post your component_file? Or was it generat
Electronics Forum | Thu May 29 11:02:23 EDT 2008 | markhoch
Omid, Your best bet would be to obtain and read the various machine manuals for the equipment that you have. HOWEVER, "programming" the reflow oven, (otherwise known as profiling), is product and solder paste specific and will most likely NOT be cove
Electronics Forum | Tue Jun 03 12:29:58 EDT 2008 | slthomas
We don't build anything with BGA yet so don't have this standard but IPC-7095B, Design and Assembly Process Implementation for BGAs would be a good place to start. I don't know for a fact that it contains info. that applies specifically to your iss
Electronics Forum | Thu Jun 26 13:55:56 EDT 2008 | dyoungquist
Water will not remove no clean flux residues because they are not water soluble. Solder paste with no clean flux should only be used when the assemblies do not need to be cleaned. That said, you can buy special cleaning solvents specifically for re
Electronics Forum | Mon Jul 07 14:42:43 EDT 2008 | slthomas
Upon further investigation I'm stumped. Usually if the data sheets don't have package and processing information in them they've got a package specific document hidden somewhere but I couldn't find one of those either. I'd check out the "Contact
Electronics Forum | Thu Aug 07 22:56:50 EDT 2008 | dlocampo
First all, you must define the specific defects that you wanted to screen out by your AOI system based on its capability, so you can allocate the undetected defects on your other means of inspection methodology. Then optimize your AOI inspection para
Electronics Forum | Thu Jul 24 22:37:06 EDT 2008 | davef
As part of the IPC-4552 specification testing, they ran ENIG at 2 uinches for 1.5 million cycles for a membrane-type keypad application [there was no testing for the wiping-type switches]. They stopped testing when the membrane began breaking down. T
Electronics Forum | Fri Jul 25 23:01:04 EDT 2008 | chip_flip
What paste are using? You should referance the manufactures time and temperature specification. Running lead-free in a 5 zone oven can be done with out a problem but it is not production friendly. If you are concerned with through put I would look fo
