Electronics Forum | Wed Jul 26 10:06:19 EDT 2000 | Doug Philbrick
I have read many of the past threads on both topics and I still am not convinced I know the answer to the soldering problem we are encountering. I am hopping someone can help. I have a dense SMT board we are building and have been building for some
Electronics Forum | Fri Jul 14 16:29:12 EDT 2000 | Dave F
Awww John, if I typed all that folderol, my spell checker would have gone kaaablewee!!! Most of the stuff I listed is tactical, because I assume most people on the forum are DFM / DFT choir and by the time we get involved, some BIG $$$ consultant ha
Electronics Forum | Fri Jul 14 16:29:31 EDT 2000 | Dave F
Awww John, if I typed all that folderol, my spell checker would have gone kaaablewee!!! Most of the stuff I listed is tactical, because I assume most people on the forum are DFM / DFT choir and by the time we get involved, some BIG $$$ consultant ha
Electronics Forum | Tue Jun 20 14:19:04 EDT 2000 | Chrys Shea
Hi Mike, The Hadco design guidelines are really good - I was just there. To expand on what Dave said, scoring is an option, but I've never had good luck with it, myself. The scores are either too shallow, and I can't break the boards easily enough
Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal
For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o
Electronics Forum | Fri May 19 11:20:12 EDT 2000 | John Thorup
Dave - well said ScottM - I'm appalled - Your management sounds like a throwback to an early industrial age where the workers were treated as a commodity. It's not right to do only what you're forced to do when protecting human beings and the enviro
Electronics Forum | Mon Apr 03 23:17:51 EDT 2000 | Brian G
We have been experiencing intermittent problems with the solder masking bubbling up from the bottom side of the board, after wave soldering. Our board fabricator claims that none of his other customers are experiencing this problem, and that it is pr
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Mon Jun 16 17:13:24 EDT 2003 | fmonette
John, Maybe you know this already but I just wanted to highlight a few facts about dry cabinets. My experience is that many engineers are not well aware of the industry guidelines and sometimes will buy a dry cabinet without understanding the key f
Electronics Forum | Sat Jan 20 20:54:03 EST 2001 | fmonette
Dear Mike, As you might have noticed from the labels on the dry bags, the maximum floor life is specified by the component manufacturer and it can range from 1 year (level 2) down to a few hours after mandatory bake (level 6). This limit is based o
