Electronics Forum | Tue Jan 23 11:55:27 EST 2001 | aiscorp
I gather from your question that you might have experienced large scale system implementation problems in the past, or at least fear experiencing it in the future. This is a very valid concern based on the performance of traditional CIM systems. Fo
Electronics Forum | Tue Feb 20 17:30:14 EST 2001 | billschreiber
Dave, I think we are heading toward the same objective, but from different directions. You are asking what's the cost of ownership? However, I think a question that is just as important and one that is pertinent to your current economic picture is,
Electronics Forum | Wed Feb 21 16:14:44 EST 2001 | billschreiber
120 degrees F (49 degrees C.), check the fine-pitch apertures for shape distortion (stainless steel has a very poor memory, once it expands, it doesn�t always contract back to the same position). Check for dings and dents. A good stencil cleaning pr
Electronics Forum | Wed Mar 14 16:01:39 EST 2001 | Rob Fischer
Not necessarily. Maybe just a little over > sensitive...? > > I though Bill provided > considerable insight relative to the process and > the original question. There was a good answer in > there. I also thought that he provided more > specifi
Electronics Forum | Wed Mar 21 09:31:39 EST 2001 | CAL
Susan - Thank you for providing more information. It is hard just to give a rule of thumb on warranty time. Comparing other contract manufactures is also misleading. I have seen 30 days to 10 year warranties from contract manufacturers. Here are some
Electronics Forum | Wed Apr 11 16:02:21 EDT 2001 | stevearneson
Let me put my two cents into this argument..After being part of many extensive studies conducted to determine the benefits of solder paste inspection, there has never been a case where the customer concluded that paste inspection (Height or Volume)wa
Electronics Forum | Wed May 09 03:29:16 EDT 2001 | Eyal Duzy
Yes, your observation is accurate. Different process steps have different inspection requirements which necessitates employing different imaging technology to ensure the best performance (detection and throughput). Orbotech, for example, offers both
Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri
The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav
Electronics Forum | Fri Jun 01 12:23:22 EDT 2001 | medernach
I've had good and bad experiences with OSP's. First of all, ask yourself, "Why use an OSP?" If you don't need it, don't use it. Solderability is dependent upon the number of thermal passes (the fewer, the better), the thickness of the coating, the
Electronics Forum | Fri Feb 04 12:04:59 EST 2000 | Michael Parker
My first comment is "Buyer beware". I think that there is enough skepticism already from potential end-users that we are all maybe too wary. I endorse the concept, it has tremendous potential for process improvements, and making life easier. I have b
