Electronics Forum | Mon Jan 04 11:32:59 EST 1999 | Chrys
| Anyone have any experience with ECD's Waverider/MOLE profiling equipment? If so, were they positive experiences? | I use ECD's mole for profiling in the wave and a KIC for profiling in reflow. I like the KIC a whole lot better for a couple of re
Electronics Forum | Tue Dec 29 17:42:27 EST 1998 | Dave F
| Can anyone recommend a solder stop that can be applied by our PCB supplier. Our current material form Tamura Kaken is causing problems. | | The material should be capable of withstanding 1 Surface mount IR reflow cycle and 1 wave solder cycle. | W
Electronics Forum | Tue Dec 22 12:32:16 EST 1998 | Earl Moon
| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,
Electronics Forum | Thu Dec 24 03:49:45 EST 1998 | John Watt
| | | Folk's, | | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour,
Electronics Forum | Fri Jul 03 09:19:21 EDT 1998 | Dave F
| | | | | WHAT IS THE BEST ANGLE FOR THE SQUEEGEE BLADE TO BE ANGLED AT? WE ARE USING 45 DEGREE ON OUR POLYURETHANE BLADES, AND I BELIVE WE HAVE THE OPTION OF EITHER 45 OR 60 DEGREES ON OUR METAL BLADES. WHICH OF THE TWO IS BETTER, OR SHOULD WE BE
Electronics Forum | Thu Jun 04 12:22:12 EDT 1998 | John Allan
| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo
Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson
| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin
Electronics Forum | Mon Jan 28 08:07:44 EST 2002 | JohnW
Sorry I keep forgetting you lot are backwards in the old metric system :0) anyhoo, yes IPC, the bastions of right well as long as your board is only 1.6mm thick (sorry 62mils)say that you need 75% min general and 50% on ground planes. I'd like to se
Electronics Forum | Tue Jul 23 12:02:17 EDT 2002 | gdstanton
Ken, Excellent discussion!!! I've also seen this problem. Spent and am still spending significant time policing. I don't think it is just a buyer issue though. There are many dimensions to the problem. Suppliers, Engineering, Manufacturing, and
Electronics Forum | Sat Aug 17 18:41:29 EDT 2002 | kenbliss
Hi Brian Thank you very much for you comments, Points well taken, forgive the length of my response here, but I wanted to respond to each of your points. The Pick and Place machine �should� be the bottleneck. The reason is in my 20 years in the in
