Electronics Forum | Wed Jun 04 08:35:48 EDT 2008 | cattle
yes and yes it has. also it has reduced the time of paste preparation after the fridge BR
Electronics Forum | Wed Oct 22 00:25:25 EDT 2008 | pyrofire76
Is it possible to have OSP and after presoldering If yes, what mask used to not to affect OSP before solder?
Electronics Forum | Sun Oct 26 21:27:09 EDT 2008 | pyrofire76
pre solder means bump formation is it poassible after OSP we will do bump formation?
Electronics Forum | Mon Aug 31 09:53:59 EDT 2009 | fujiphil
after sending all the datas.... proper, program and status... Re-boot the machine...
Electronics Forum | Tue Dec 01 09:24:01 EST 2009 | sforman1
40 years. no cost to you. just trying to help Sam
Electronics Forum | Thu May 13 03:38:22 EDT 2010 | aungthura
Hi Dave the issue is the sockets were deformed after soldered by reflow. Hope that is ur asking.
Electronics Forum | Fri Jul 16 08:03:33 EDT 2010 | vetteboy86
After reflow, is where this is noticed.
Electronics Forum | Mon Jul 04 01:30:24 EDT 2011 | rickysanchez
we encounter bubbles on silicone coating after oven curing.what to do to avoid bubbles?
Electronics Forum | Tue Nov 08 16:46:19 EST 2011 | burb1999
Looking for inspection right after the placement machines to catch all that can be caught before reflow.
Electronics Forum | Thu May 10 09:08:20 EDT 2012 | blnorman
Thickness wet or after cured?
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