Electronics Forum | Thu Jun 23 20:09:03 EDT 2005 | Stefan
Optimizers for pick and place machines are very specific for the type and model of the machine you are using. A chip-shooter will run at optimal speed with the same type of nozzle and minimal table movement. Most X-Y tables have a faster X-axis than
Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero
I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has
Electronics Forum | Sat Mar 25 00:02:17 EST 2006 | rpowell
Hi everyone, I'm relatively new to SMT PCB design and am running into some frustration with the land pattern design of "standard" smt components in particular passive chip components. It seems each manufacturer (Yageo, Rohm, Panasonic) has their own
Electronics Forum | Mon Apr 17 22:54:51 EDT 2006 | Darby
Short answer is - not really. According to the manual in Chapter 1-5 Supply devices (Feeders) overview "There are also available an 8mm tape feeder which handles 1005(0402) square chips". I have never seen one. The problem is that even an H nozzle is
Electronics Forum | Mon Aug 21 04:20:49 EDT 2006 | Rob
Hi Mika, I used to work for the largest chip cap manufacturer in the world, and by far the largest problem we would see was cracking due to incorrect z height adjustment on Chipshooters. It can also cause solderballs and bad joints by displacing th
Electronics Forum | Fri Sep 08 09:16:37 EDT 2006 | james
We are incurring problems with Film Chip Capacitors with reflow issues. Some of the parts are misaligning or not soldering on one end (almost tombstoning) . We left the parts in the dry cabinet till they were used. We tried both reflow ovens (hell
Electronics Forum | Thu Dec 21 02:27:57 EST 2006 | pavel_murtishev
Good morning, (1) This depends on component type. In general it would be better to have fully populated board. Or at least you should mount components with different thermal mass. You should place TC�s at three points at least: component with high t
Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest
Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te
Electronics Forum | Thu Jun 28 11:51:24 EDT 2007 | mika
Hi, Are we talking about the pick-up tolerance so for any chip component set it to 0.5mm. It will save a lot of trouble right there. As for body tolerence if it is a zero then it will automatically use a standard value, based on the size of the body
Electronics Forum | Mon Jan 14 12:28:06 EST 2008 | swag
We are in North Western U.S. I like 2.6 better (for our mix of builds, anyway). 1.0 works great on PTF parts such as fine pitch QFP's but I don't like it for chips. It's too picky and we wind up forcing parts to the 4.0. We have another GSM dual
