Electronics Forum | Thu May 10 15:48:12 EDT 2001 | kp
Good morning, We are presently using a couple surface mount parts on our circuit boards. We send the boards out of house to have the SMD parts placed. I have been told that the apertures for the stencil for each SMD are not to be 1:1 with
Electronics Forum | Mon Jul 30 21:07:35 EDT 2001 | davef
So, yer loosing parts between place and reflow? That would seem to say yer: * Paste has lost tackiness [check the fine SMTnet Archives for a sample test.]. * Really not placing the parts that you think yer placing. * Knocking the parts out of place
Electronics Forum | Sat Jan 29 00:30:09 EST 2000 | Micah Newcomb
Mike, I found the easiest way around your issue is to get your parts in T&R rather then trying to modify your machine. Some part manufacturers may be unwilling to T&R your part but there is always a ready and willing company whom would be happy to d
Electronics Forum | Wed Nov 24 07:02:15 EST 1999 | JAX
Larry, Carl's right about vision 254 and 255 but I believe CP4's can be set up to check for a part on the nozzle,(parts check sensor)like any other CP. This could be activated to make sure parts are being placed. Then again CP4's might not ha
Electronics Forum | Wed Jul 21 13:05:17 EDT 1999 | John
Looking for a cross-referencing and part identification guide for surface-mount components. There is very little infomation provided on some of the components themselves, and we often don't have parts lists or schematics for items we repair, so ident
Electronics Forum | Wed Mar 10 12:02:07 EST 1999 | Craig Holloway
Looking for advice/products on ways to get heat out of a package and into an internal thermal plane. Will have electrically isolated thermal pads (going to an internal thermal plane) under the part. Need a way to get good thermal contact between par
Electronics Forum | Thu Mar 11 11:58:18 EST 1999 | P.L. Sorenson - Technical Consultant
| Looking for advice/products on ways to get heat out of a package and into an internal thermal plane. Will have electrically isolated thermal pads (going to an internal thermal plane) under the part. | | Need a way to get good thermal contact betwe
Electronics Forum | Wed Oct 07 03:34:11 EDT 1998 | Thomas Blesinger
I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remaining
Electronics Forum | Fri Sep 04 11:43:42 EDT 1998 | Ben Salisbury
Is anyone out there currently running Panasonic P/N EFOS5004E5? It is a 5MHZ resonator...if so, are you running into any process problems with the part? Have you solved any problems arising with the part, and if so, what did you end up doing to resol
Electronics Forum | Tue Aug 18 10:05:11 EDT 1998 | Ben Salisbury
Question: If a PCB and the lands of a part both had electroless plating, would there be a higher tendancy for intermetallics to form in and on the solderjoint...versus just the PCB or Just the part being plated? I'm currently running into this proble
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