Electronics Forum | Sun Aug 31 07:13:13 EDT 2008 | allan99
All that they are telling is important (variants in the process), what you can do in a fast way is: change the component for a new one (date of manufacture / other supply - if you have); change the component (test - same package but other specificati
Electronics Forum | Thu Sep 18 12:11:45 EDT 2008 | jwentz
Does anyone have experience with using Pb-free SAC105? We are looking at the pro's/con's compared to a SAC305 process for a SMT operation. I have read it has a higher melting temperature. Specifically, we are concerned about a product we are developi
Electronics Forum | Mon Sep 29 16:02:33 EDT 2008 | scottd3
We are having problems with a specific lot of boards wave soldering. I need a way to prove the boards are bad, does anyone know a way to verify the amount of OSP coating on a board, or a company I can get to do it for me? I am using PBfree solder of
Electronics Forum | Mon Oct 13 01:28:37 EDT 2008 | kywl
Hi, I would like to ask if there's a guideline/specification on what is needed to qualify a new SMT automated assembly line? Is there any standards i can refer to? IPC or JEDEC? Is there a reference number for the standards so i can refer to as we
Electronics Forum | Mon Nov 03 23:30:18 EST 2008 | kpm135
I would contact the manufacture of your machine. I believe this is usually pretty machine specific. I don't know if a company like Unisoft makes a module that will help you do this, but if you want anything that actually communicates with the your pi
Electronics Forum | Wed Nov 19 10:17:11 EST 2008 | jdengler
Hi aj, The X-ray vendors can probably give you more specific info for your loaction. They have told me it varies by location. At my site I would need a state issued license which would require annual testing for X-ray leakage. Jerry
Electronics Forum | Tue Dec 09 14:03:05 EST 2008 | pms
Steve, We use stencils for applying adhesives to PCB's, with our DEK Proflow system. Works well for us. Once in a while, we have to manually add adhesive to a specific location depending on the component height. Vary rare though. You shouldn't have
Electronics Forum | Tue Jan 20 10:30:56 EST 2009 | milas
Hi We have just specified the following thicknesses for the Nickel and Gold on an ENIG finish board. The baord is to be manufactured using a lead - free process. My question: Is the thickness we've specificed likely to gie us any issues during manuf
Electronics Forum | Mon Jan 26 22:43:45 EST 2009 | davef
Questions are: * Can you use the part fabricator's specification of lead coplanairity as the basis for accepting this build? * Beyond the issue of acceptable deformation of the leads, how do you know that whatever you did to bend the two outer leads
Electronics Forum | Wed Feb 04 16:33:40 EST 2009 | davef
Your specification for all PCB suppliers of 'solder mask over bare copper using LPI on external layers (green)' is broad and open to the use of material from many possible LPI suppliers by your board fabricator. In at least one case, it appears that
